CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces.[1] The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio (Intel High Definition Audio). All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules.[2]

CoreExpress modules are mounted on a custom carrier board, containing the peripherals required for the specific application. In this way, small but highly specialized computer systems can be built.

The CoreExpress form factor was originally developed by LiPPERT Embedded Computers[3][4] and standardized by the Small Form Factor Special Interest Group (SFF-SIG) in March 2010.[5][6] It was competing with other standards like COM Express or Qseven.[7] Initially adopted by the German LiPPERT and the Swiss company DIGITAL-LOGIC[8] (which has meanwhile been bought by Kontron),[6] it was later backed up by more then eight vendors[6] including Syslogic.

CoreExpress dimensions

Size and mechanics

The specification defines a board size of 58 mm × 65 mm, slightly smaller than a credit card and small enough to allow a carrier board in standard PC/104-Plus format.[1][9]

The module can be embedded into a heat spreader, which distributes the component-generated heat onto a larger surface area. In low power applications, this distribution may be enough for complete thermal dissipation.

In higher power applications, the heat spreader presents a thermal interface for mating to additional heat dissipating components such as finned heat sinks. Heat spreaders are simpler and more rugged to connect to than the heat generating components underneath. This simplifies mechanical design for the system builder, but can be less efficient than a complete purpose-built thermal solution.

In a complete system, heat spreaders can be part of the electromagnetic interference containment design.

Specification

The specification is hosted by the SFF-SIG and is available on their website. Revision 2.1 was released on 23 February 2010.[10]

See also

References

  1. ^ a b "Die nächste COM-Generation" [The next COM generation]. Megalink Precision - Elektronik - Automation (in German). No. 10. AZ Fachverlage AG. October 2008. p. 101. Retrieved 2024-03-17.
  2. ^ "What is CoreExpress?". Small Form Factor Special Interest Group. Archived from the original on 2013-08-23. Retrieved 2013-07-23.
  3. ^ "ADLINK announces the 100% share acquisition of LiPPERT Embedded Computers". Archived from the original on 2017-06-17. Retrieved 2019-09-13.
  4. ^ Kunze, Sariana (2012-02-09). "LiPPERT Embedded Computers für 7 Mio. gekauft" [LiPPERT Embedded Computers bought for 7 millions]. Markt & Branche: Strategie & Unternehmensführung. Elektrotechnik Automatisierung (in German). Vogel Communications Group [de]. Archived from the original on 2024-03-17. Retrieved 2024-03-17.
  5. ^ "SFF-SIG Adopts CoreExpress Specification to Strengthen PCIe 2.0-Ready COM Portfolio" (PDF). Press release. Small Form Factor Special Interest Group. 2010-03-02. Archived from the original (PDF) on 2010-11-28. Retrieved 2013-07-23.
  6. ^ a b c Kreuzer, Manne (2010-02-26). "CoreExpress wird offener Standard - Computer-on-Module-Technologie offengelegt" [CoreExpress becomes open standard]. Embedded. elektroniknet.de (in German). WEKA Fachmedien GmbH [de]. Archived from the original on 2024-03-17. Retrieved 2024-03-17.
  7. ^ Wilson, Andy (2018-07-01). "Low-cost peripherals target embedded systems designers - Highly integrated camera modules and processors are lowering the cost of building embedded vision systems". Cameras and Accessories. Vision Systems Designn. Endeavor Business Media, LLC. Archived from the original on 2024-03-17. Retrieved 2024-03-17.
  8. ^ "smartCore Express SMA200" (Technical User's Manual). 1.0. Luterbach, Switzerland: DIGITAL-LOGIC AG. September 2008 [July 2008]. Retrieved 2024-03-17.
  9. ^ Graunitz, Björn (2010-05-19). "CoreExpress-ECO jetzt auch mit VxWorks - Computer-on-Module" [CoreExpress-ECO now also with VxWorks]. Automotive > Software + Tools. elektroniknet.de (in German). WEKA Fachmedien GmbH [de]. Archived from the original on 2024-03-17. Retrieved 2024-03-17.
  10. ^ "CoreExpress Specification" (PDF). Small Form Factor Special Interest Group. 2010-02-23. Archived from the original (PDF) on 2011-10-04. Retrieved 2013-07-23.

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