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((Short description|NEMA grade designation for glass-reinforced epoxy laminate material))
((more citations needed|date=September 2014))
((use dmy dates|date=March 2021|cs1-dates=y))
'''FR-4''' (or '''FR4''') is a [[National Electrical Manufacturers Association|NEMA]] grade designation for glass-reinforced epoxy laminate material. FR-4 is a [[composite material]] composed of woven [[fiberglass]] cloth with an [[epoxy resin]] binder that is [[flame resistant]] (''self-extinguishing'').

"FR" stands for "flame retardant", and does not denote that the material complies  with the standard [[UL 94|UL94V-0]] unless testing is performed to UL 94, Vertical Flame testing in Section 8 at a compliant lab. The designation FR-4 was created by NEMA in 1968.

FR-4 glass epoxy is a popular and versatile high-pressure thermoset plastic laminate grade with good strength to weight ratios. With near zero water absorption, FR-4 is most commonly used as an electrical insulator possessing considerable mechanical strength. The material is known to retain its high mechanical values and electrical insulating qualities in both dry and humid conditions. These attributes, along with good fabrication characteristics, lend utility to this grade for a wide variety of electrical and mechanical applications.

Grade designations for glass epoxy laminates are: [[G10 (material)|G-10]], G-11, FR-4, [[FR-5]] and [[FR-6]]. Of these, FR-4 is the grade most widely in use today. G-10, the predecessor to FR-4, lacks FR-4's self-extinguishing flammability characteristics. Hence, FR-4 has since((When|date=August 2012)) replaced G-10 in most applications.

FR-4 epoxy resin systems typically employ [[bromine]], a halogen, to facilitate flame-resistant properties in FR-4 glass epoxy laminates. Some applications where thermal destruction of the material is a desirable trait((Citation needed|date=December 2020)) will still use G-10 ''non flame resistant''.

== Properties ==
Which materials fall into the "FR-4" category is defined in the NEMA LI 1-1998 standard. Typical physical and electrical properties of FR-4 are as follows. The abbreviations LW (lengthwise, warp yarn direction) and CW (crosswise, fill yarn direction) refer to the conventional perpendicular fiber orientations in the XY plane of the board (in-plane). In terms of [[Cartesian coordinates]], lengthwise is along the x-axis, crosswise is along the y-axis, and the z-axis is referred to as the through-plane direction. The values shown below are an example of a certain manufacturer's material. Another manufacturer's material will usually have slightly  different values. Checking the actual values, for any particular material, from the manufacturer's datasheet, can be very important, for example in [[high frequency]] applications.

{| class="wikitable"
|- 
! Parameter                                 !! Value
|-
| [[Density|Specific gravity/density]]      || ((convert|1.850|g/cm3|lb/in3|abbr=on)) <!-- 1.85&nbsp;g/cm³ -->
|-
| Water absorption                          || −0.125&nbsp;in < 0.10% 
|-
| Temperature index                         || ((convert|140|°C|°F|abbr=on))
|-
| [[Thermal conductivity]], through-plane   || 0.29 W/(m·K),<ref name="IEEE_1996"/> 0.343 W/(m·K)<ref name="Savar-Poole-Witting_1990"/>
|-
| Thermal conductivity, in-plane            || 0.81 W/(m·K),<ref name="IEEE_1996"/> 1.059 W/(m·K)<ref name="Savar-Poole-Witting_1990"/>  
|-
| Rockwell hardness                         || 110 M scale 
|-
| Bond strength                             || > ((convert|1000|kg|lb|abbr=on))
|-
| Flexural strength (A; 0.125 in) – LW      || > ((convert|415|MPa|psi|abbr=on))
|-
| Flexural strength (A; 0.125 in) – CW      || > ((convert|345|MPa|psi|abbr=on))
|-
| Dielectric breakdown (A)                  || > 50&nbsp;kV
|-
| Dielectric breakdown (D48/50)             || > 50&nbsp;kV
|-
| [[Dielectric strength]]                   || 20&nbsp;MV/m <!-- 20 kV/mm; 500 V/mil --> 
|-
| [[Relative permittivity]] (A)             || 4.4
|-
| Relative permittivity (D24/23)            || 4.4 
|-
| [[Dissipation factor]] (A)                || 0.017
|-
| Dissipation factor (D24/23)               || 0.018
|-
| Dielectric Constant (ε<sub>r</sub>) || ((Nowrap|3.9 – 4.7)),<ref name="Altera_2003"/> ((nowrap|4.4 @ 1 GHz (Supplier Isola)  ))<ref name="Atmel_2003"/>
|-
|Loss Tangent (tanδ)
|0.02 – 0.03,<ref name="Altera_2003"/> 0.030 @ 1 GHz<ref name="Avago_2005"/><ref name="Atmel_2003"/>
|-
| Glass transition temperature              || Can vary, but is over 120&nbsp;°C
|-
| Young's modulus – LW                      || ((convert|3.5|e6psi|GPa|abbr=on))
|-
| Young's modulus – CW                      || ((convert|3.0|e6psi|GPa|abbr=on))
|-
| Coefficient of thermal expansion – ''x''-axis || 1.4((e|-5))&nbsp;K((sup|−1))
|-
| Coefficient of thermal expansion – ''y''-axis || 1.2((e|-5))&nbsp;K((sup|−1))
|-
| Coefficient of thermal expansion – ''z''-axis || 7.0((e|-5))&nbsp;K((sup|−1))
|-
| Poisson's ratio – LW                      || 0.136 
|-
| Poisson's ratio – CW                      || 0.118
|- 
| LW sound speed                            || 3602&nbsp;m/s
|- 
| CW sound speed                            || 3369&nbsp;m/s
|- 
| LW acoustic impedance                     || 6.64 MRayl
|}
where:
; LW: Lengthwise
; CW: Crosswise
; PF: Perpendicular to laminate face

== Applications ==

FR-4 is a common material for [[printed circuit board]]s (PCBs). A thin layer of [[copper foil]] is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The [[copper thickness]] or [[copper weight]] can vary and so is specified separately. 

FR-4 is also used in the construction of [[relay]]s, [[switch]]es, [[standoff (separator)|standoff]]s, [[busbar]]s, [[washer (hardware)|washer]]s, [[electric arc|arc]] shields, [[transformer]]s and [[screw terminal]] strips.

==See also==
*[[FR-2]]
*[[Polyimide]]
*[[G-10 (material)]]

==References==
((Reflist|refs=
<ref name="IEEE_1996">((cite book |author-last1=Azar |author-first1=Kaveh |author-last2=Graebner |author-first2=John E. |title=Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings |chapter=Experimental determination of thermal conductivity of printed wiring boards |date=1996 |pages=169–182 |doi=10.1109/STHERM.1996.545107|isbn=0-7803-3139-7 |s2cid=110285100 ))</ref>
<ref name="Savar-Poole-Witting_1990">((cite journal |author-last1=Sarvar |author-first1=F. |author-first2=N. J. |author-last2=Poole |author-first3=P. A. |author-last3=Witting |title=PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation |journal=[[Journal of Electronic Materials]] |date=1990 |volume=19 |issue=12 |pages=1345–1350 |doi=10.1007/bf02662823|bibcode=1990JEMat..19.1345S |s2cid=95273262 ))</ref> 
<ref name="Altera_2003">((cite journal |publisher=[[Altera Corporation]] |date=2003 |title=Using Pre-Emphasis and Equalization with Stratix GX |url=https://datasheet.datasheetarchive.com/originals/library/Datasheets-SW6/DSASW00108149.pdf |journal=ALTERA Datasheet |pages=3))</ref>
<ref name="Atmel_2003">((cite journal |journal=[[Atmel Corporation]] |date=2003 |title=HF Transmission |url=https://datasheet.datasheetarchive.com/originals/library/Datasheet-02/DSA0019066.pdf |pages=7))</ref>
<ref name="Avago_2005">((cite journal |journal=[[Avago Technologies]] |date=2005 |title=PCB Layout Guidelines for Designing with Avago SFP+Transceivers |url=https://datasheet.datasheetarchive.com/originals/library/Datasheet-080/DASF001217.pdf |pages=2))</ref>
))

==Further reading==
* ((cite book |title=Industrial Laminated Thermosetting Products |publisher=[[National Electrical Manufacturers Association]] (NEMA) |id=NEMA LI 1-1998 (R2011) |date=2012-02-01 |orig-date=2011, 1998 |url=http://www.nema.org/Standards/Pages/Industrial-Laminated-Thermosetting-Products.aspx))

[[Category:Printed circuit board manufacturing]]
[[Category:Fibre-reinforced polymers]]

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