Qualcomm Snapdragon
General information
Launched2007; 15 years ago (2007)
Designed byQualcomm
Architecture and classification
ApplicationMobile SoC and 2-in-1 PC
MicroarchitectureARM11, Cortex-A5, Cortex-A7, Cortex-A53, Cortex-A55, Cortex-A57, Cortex-A72, Cortex-A75, Cortex-A76, Cortex-A77, Cortex-A78, Cortex-X1, Cortex-A510, Cortex-A710, Cortex-A715, Cortex-X2, Cortex-X3, Scorpion, Krait, Kryo
Instruction setARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Physical specifications
Cores
  • 1, 2, 4, 6, or 8

This is a list of Qualcomm Snapdragon processors. Snapdragon is a family of mobile system on a chip (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.[1]

Model number Fab CPU GPU (or Gfx Core) Connectivity Sampling availability
QSC1xxx
QSC1100 Q4 2007
QSC6xxx
QSC6010 ARMv5TEJ ARM926EJ-S[citation needed] No 3D and ARM 2D None 2006
QSC6020
QSC6030
QSC6240 HSDPA Q3 2007
QSC6245-1 HSDPA Q3 2007
QSC6055 Q1 2007
QSC6065 HSDPA Q2 2007
QSC6260-1 Q3 2007
QSC6270 HSDPA
QSC6075 Q2 2007
QSC6085 DOrA Q4 2007
MSM6xxx
MSM6000 None 2006
MSM6025
MSM6050
MSM6100 ARM-DSP 3D and ARM 2D
MSM6125
MSM6150 Defender2 3D and ARM 2D
MSM6175
MSM6225 No 3D and ARM 2D HSDPA
MSM6250 ARM-DSP 3D and ARM 2D WCDMA 2006
MSM6250A No 3D and ARM 2D WCDMA
MSM6245 WEDGE
MSM6255A
MSM6260 ARMv5TEJ ARM926EJ-S @ 225 Mhz[2] ARM-DSP 3D and ARM 2D HSUPA
MSM6275 Defender2 3D and ARM 2D
MSM6280
MSM6280A Stargate 3D and ARM 2D 2007
MSM6800A Defender3 3D and ARM 2D DOrA 2006
MSM6575 DOr0
MSM6550 ARMv5TEJ ARM926EJ-S @ 225 Mhz[3] Defender2 3D and ARM 2D
MSM6550A
MSM6800 DOrA
MSM6500 ARMv5TEJ ARM926EJ-S @ 150 Mhz[4] ARM-DSP 3D and ARM 2D DOr0
MSM7xxx
MSM7200 Imageon 3D

Imageon 2D

HSUPA 2006
MSM7200A ARM11 @ 528 Mhz Q1 2007
MSM7201[5][6] 2008
MSM7500 DOrA 2006
MSM7500A Q4 2007
MSM7600 65 nm ARM1136J-S @ 528Mhz[5][6] HSUPA and DOrA Q1 2007
MSM7850 LT 3D and LT 2D DOrB 2008

Snapdragon S series

Snapdragon S1

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S1

Snapdragon S1 notable features over its predecessor (MSM7xxx):

Model number Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7225[8] 65 nm 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache Software rendered 2D support (HVGA) Hexagon QDSP5 320 MHz Up to 5 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 2007
MSM7625[8] CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227[8] 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache Adreno 200 226 MHz (FWVGA) Up to 8 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS; GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008
MSM7627[8] CDMA/UMTS; GSM
MSM7225A[8] 45 nm 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 245 MHz (HVGA) Hexagon QDSP5 350 MHz Up to 5 MP camera LPDDR Single-channel 200 MHz (1.6 GB/s) UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 Q4 2011
MSM7625A[8] CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A[8] 1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 245 MHz (FWVGA) Up to 8 MP camera UMTS, MBMS; GSM
MSM7627A[8] CDMA2000/UMTS, MBMS; GSM
MSM7225AB[8][9][10] UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250[8] 65 nm 1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 226 MHz (WXGA) Hexagon QDSP6 600 MHz Up to 12 MP camera LPDDR Single-channel 400 MHz UMTS, MBMS; GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 Q4 2008
QSD8650[8] CDMA2000/UMTS, MBMS; GSM

Snapdragon S2

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S2

Snapdragon S2 notable features over its predecessor (Snapdragon S1):

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7230[8] 45 nm 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 Adreno 205 266 MHz (XGA) Hexagon QDSP5 256 MHz Up to 12 MP camera LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)[15] UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 Q2 2010
MSM7630[8] CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055[8] 1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2 -
MSM8255[8] 1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655[8] CDMA2000/UMTS, MBMS; GSM
MSM8255T[8] 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655T[8] CDMA2000/UMTS, MBMS; GSM

Snapdragon S3

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S3

Snapdragon S3 notable features over its predecessor (Snapdragon S2):

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8060[8] 45 nm 2 cores up to 1.7 GHz Scorpion: 512KB L2 Adreno 220 266 MHz (WXGA+) Hexagon QDSP6 400 MHz Up to 16 MP camera LPDDR2 Single-channel 333 MHz (2.67 GB/s)[17] - Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 2011
MSM8260[8] UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) Q3 2010
MSM8660[8] CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM

Snapdragon S4

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.[18] It was launched in 2012.

The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)

Snapdragon S4 Play

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Play
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225[18] 45 nm 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 Adreno 203 320 MHz (FWVGA) Hexagon Up to 8 MP camera LPDDR2 Single-channel 300 MHz UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 1H 2012
MSM8625[18] CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM

Snapdragon S4 Plus

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Plus

Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8227[18] 28 nm 2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 320 MHz (FWVGA / 720p) Hexagon QDSP6 LPDDR2 Single-channel 400 MHz UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 2H 2012
MSM8627[18] CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030[18] 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 400 MHz (qHD / 1080p) Up to 13.5 MP camera LPDDR2 Single-channel 533 MHz - 3Q 2012
MSM8230[18] UMTS; GSM
MSM8630[18] CDMA/UMTS; GSM
MSM8930[18] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A[18] 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 225 400 MHz (WUXGA / 1080p) Up to 20 MP camera LPDDR2 Dual-channel 500 MHz - 2H 2012
MSM8260A[18] UMTS; GSM Q1 2012
MSM8660A[18] CDMA/UMTS; GSM
MSM8960[18][20] World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Pro

Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8260A Pro[18] 28 nm LP 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 320 400 MHz (WUXGA / 1080p) Hexagon QDSP6 Up to 20 MP camera LPDDR2 Dual-channel 500 MHz UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T[18] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) Q2 2012
MSM8960T Pro (MSM8960AB[21])[18]
MSM8960DT[18][22] 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor Q3 2013
APQ8064[18][20] 4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) LPDDR2 Dual-channel 533 MHz[23] External 2012

Snapdragon 2 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 2 series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 (2013)

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225Q[24] 45 nm LP 4 cores up to 1.4 GHz Cortex-A5 Adreno 203 400 MHz (up to 540p) Hexagon QDSP5 Up to 8 MP camera LPDDR2 Single-channel 333 MHz Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 2013
MSM8625Q[24] Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210[24][25] 28 nm LP 2 cores up to 1.2 GHz Cortex-A7 Adreno 302 400 MHz (up to 720p) Hexagon QDSP6 Gobi 3G (UMTS; GSM) 2013
MSM8610[24][25] Gobi 3G (CDMA/UMTS; GSM)
MSM8212[24][25] 4 cores up to 1.2 GHz Cortex-A7 Gobi 3G (UMTS; GSM)
MSM8612[24][25] Gobi 3G (CDMA/UMTS; GSM)

Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)

The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.[26]
The Snapdragon 212 was announced on July 28, 2015.[27]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.[28]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8905 (205)[29] 28 nm LP 2 cores up to 1.1 GHz Cortex-A7 Adreno 304 (WXGA / 720p) Hexagon 536 Up to 3 MP camera LPDDR2/3 Single-channel 384 MHz X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) 2017
MSM8208 (208)[30] Up to 5 MP camera LPDDR2/3 Single-channel 400 MHz Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) 2.0 2014
MSM8909 (210)[31] 4 cores up to 1.27 GHz Cortex-A7 Up to 8 MP camera LPDDR2/3 Single-channel 533 MHz X5 LTE
MSM8909AA (212)[32] 4 cores up to 1.3 GHz Cortex-A7 2015

Qualcomm 215 (2019)

The Qualcomm 215 was announced on July 9, 2019.[33] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
QM215[34] 28 nm LP 4 cores up to 1.3 GHz Cortex-A53 Adreno 308 (HD+) Hexagon Up to 13 MP camera / 8 MP dual LPDDR3 Single-channel 672 MHz 3 GB X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 1.0 Q3 2019

Snapdragon 4 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 4 series

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 (2013)

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8026[35] 28 nm LP 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 Adreno 305 400 MHz Hexagon QDSP6 Up to 13.5 MP camera LPDDR2/3 Single-channel 533 MHz - Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS 1.0 Q4 2013
MSM8226[35] Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626[35] Gobi 3G (CDMA/UMTS)
MSM8926[35] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028[35] 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 -
MSM8228[35] Gobi 3G (UMTS)
MSM8628[35] Gobi 3G (CDMA/UMTS)
MSM8928[35] Gobi 4G (LTE Cat 4)
MSM8230[35] 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 LPDDR2 Single-channel 533 MHz Gobi 3G (UMTS)
MSM8630[35] Gobi 3G (CDMA/UMTS)
MSM8930[35] Gobi 4G (LTE Cat 4)
MSM8930AA[35] 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4)
APQ8030AB[35] 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 -
MSM8230AB[35] Gobi 3G (UMTS)
MSM8630AB[35] Gobi 3G (CDMA/UMTS)
MSM8930AB[35] Gobi 4G (LTE Cat 4)

Snapdragon 410, 412 and 415 (2014/15)

The Snapdragon 410 was announced on December 9, 2013.[36] It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.[37]
The Snapdragon 412 was announced on July 28, 2015.[27]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.[38]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8016 (410) 28 nm (SMIC) 4 cores up to 1.2 GHz Cortex-A53 Adreno 306 450 MHz (WUXGA / 1920×1200 + 720p external display) Hexagon QDSP6 V5 Up to 13.5 MP camera LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) - Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 1H 2014
MSM8916 (410)[39] X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2 (412)[40] 4 cores up to 1.4 GHz Cortex-A53 LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) 2H 2015
MSM8929 (415)[41] 28 nm LP 8 cores up to 1.4 GHz Cortex-A53 Adreno 405 (HD @60fps) Hexagon V50 Up to 13 MP camera LPDDR3 Single-channel 667 MHz Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS

Snapdragon 425, 427, 430 and 435 (2015/16)

Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.[42]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.[43]
The Snapdragon 427 was announced on October 18, 2016.[44][45]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8917 (425)[46] 28 nm LP 4 cores up to 1.4 GHz Cortex-A53 Adreno 308 (HD @60fps) Hexagon 536 Up to 16 MP camera LPDDR3 Single-channel 667 MHz X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C 2.0 Q3 2016
MSM8920 (427)[47] X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 Q1 2017
MSM8937 (430)[48] 8 cores up to 1.4 GHz Cortex-A53 Adreno 505 (FHD / 1080p) Up to 21 MP camera LPDDR3 Single-channel 800 MHz X6 LTE Q2 2016
MSM8940 (435)[49] X9 LTE Q4 2016

Snapdragon 429, 439 and 450 (2017/18)

The Snapdragon 450 was announced on June 28, 2017.[50] Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.[51] Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM429[52] 12 nm FinFET (TSMC) 4 cores up to 1.95 GHz Cortex-A53 Adreno 504 (HD / HD+) Hexagon 536 Up to 16 MP camera / 8 MP dual LPDDR3 X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0 3.0 Q3 2018
SDM439[53] 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)[54] Adreno 505 (Full HD / Full HD+) Up to 21 MP camera / 8 MP dual
SDM450[55] 14 nm LPP 8 cores up to 1.8 GHz Cortex-A53 Adreno 506 600 MHz (WUXGA / Full HD / Full HD+) Hexagon 546 Up to 21 MP camera / 13 MP dual LPDDR3 Single-channel 933 MHz X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 Q3 2017

Snapdragon 460 (2020)

The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.[56]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4250-AA (460)[57] 11 nm 4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 240 Silver – Cortex-A53 derivative) Adreno 610 (up to Full HD+) Hexagon 683 Spectra 340 (48 MP camera / 16 MP dual with MFNR/ZSL) LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB C 3.0 Q1 2020

Snapdragon 480/480+ 5G (2021)

The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.[58]
The Snapdragon 480+ was announced on October 26, 2021.[59]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4350 (480)[60] 8 nm LPP 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 460 Silver – Cortex-A55 derivative) Adreno 619 (Full HD+@120 Hz) Hexagon 686 (3.3 TOPS) Spectra 345 (64 MP single camera / 25 MP + 13 MP at 30fps Dual Camera with ZSL) / Triple camera: 3x 13 MP at 30 fps with MFNR/ZSL LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, Wi-Fi 6 ready (802.11ax/ac wave 2/n/g/b/a) 4+ H1 2021
SM4350-AC (480+)[61] 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 460 Silver – Cortex-A55 derivative) Internal X51 5G/LTE (5G: download up to 2.5 Gbit/s, upload: up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, NFC, Wi-Fi 6 ready (802.11ax/ac wave 2/n/g/b/a) Q4 2021

Snapdragon 4 Gen 1 (2022)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.[62]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4375 (4 Gen 1)[63] 6 nm N6 (TSMC) 2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 derivative + 1.8 GHz Kryo Silver – Cortex-A55 derivative) Adreno (Full HD+@120 Hz) Hexagon Spectra (Single camera: 108 MP, 32 MP at 30fps with MFNR/ZSL / Dual camera: 25 MP + 13 MP at 30fps with MNFR/ZSL / Triple camera: 3x 13 MP at 30 fps with MNFR/ZSL) LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, NFC, Wi-Fi 5 (802.11ac, 802.11a/b/g/n 2x2 (MU-MIMO)) 4+ Q3 2022

Snapdragon 6 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 6 series

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 (2013)

The Snapdragon 600 was announced on January 8, 2013.[64] Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro 28 nm LP 4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) Hexagon QDSP6 V4 500 MHz Up to 21 MP camera DDR3L-1600 (12.8 GB/sec) External Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A 1.0 Q1 2013
APQ8064M[65] 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 LPDDR3 Dual-channel 32-bit 533 MHz
APQ8064T[65] LPDDR3 Dual-channel 32-bit 600 MHz
APQ8064AB[65] 4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 450 MHz (QXGA / 1080p)

Snapdragon 610, 615 and 616 (2014/15)

The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.[66] The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

The Snapdragon 616 was announced on July 31, 2015.[68]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8936 (610)[69] 28 nm LP 4 cores 1.7 GHz Cortex-A53 Adreno 405 550 MHz (2560×1600 / Quad HD / WQXGA) Hexagon V50 700 MHz Up to 21 MP camera LPDDR3 Single-channel 800 MHz (6.4 GB/s) X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou 2.0 Q3 2014
MSM8939 (615)[70] 4 + 4 cores (1.5 GHz + 1.0 GHz Cortex-A53) Q3 2014
MSM8939 v2 (616)[71] 4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53) Q3 2015

Snapdragon 617, 625 and 626 (2015/16)

The Snapdragon 617 was announced on September 15, 2015.[42]
The Snapdragon 625 was announced on February 11, 2016.[72]
The Snapdragon 626 was announced on October 18, 2016.[73] Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8952 (617)[74] 28 nm LP 4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53) Adreno 405 550 MHz (FHD / 1080p) Hexagon 546 Up to 21 MP camera LPDDR3 Single-channel 933 MHz (7.5 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0 3.0 Q4 2015
MSM8953 (625)[75] 14 nm LPP 8 cores up to 2.0 GHz Cortex-A53 Adreno 506 650 MHz (FHD / 1080p) Up to 24 MP camera / 13 MP dual X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 3.0 Q2 2016
MSM8953 Pro (626)[76] 8 cores up to 2.2 GHz Cortex-A53 Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0 Q4 2016

Snapdragon 650 (618), 652 (620) and 653 (2015/16)

The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.[38] They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.[77]
The Snapdragon 653 was announced on October 18, 2016.[44][45]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8956 (650)[78] 28 nm HPm 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) Adreno 510 600 MHz (Quad HD / 2560x1600) Hexagon V56 Up to 21 MP camera / 13 MP dual LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 3.0 Q1 2016
MSM8976 (652)[79] 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976 Pro (653)[80] 4 + 4 cores (1.95 GHz Cortex-A72 +
1.44 GHz Cortex-A53) 		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Q4 2016

Snapdragon 630, 636 and 660 (2017)

Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.[81]
The Snapdragon 636 was announced on October 17, 2017.[82]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM630[83] 14 nm LPP 4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)[84][85] Adreno 508 (QXGA / Full HD / 1920x1200) Hexagon 642 Spectra 160 (Up to 24 MP camera / 13 MP dual) LPDDR4 Dual-channel 1333 MHz X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 4.0 Q2 2017
SDM636[86] 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.6 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 509 (FHD+) Hexagon 680 Spectra 160 (Up to 24 MP camera / 16 MP dual) Q4 2017
SDM660[87] 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.84 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 512 (WQXGA / Quad HD / 2560x1600) Spectra 160

(48 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4 Dual-channel 1866 MHz Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 Q2 2017
SDA660[88] Internal: no Q2 2017

Snapdragon 632 and 670 (2018)

The Snapdragon 632 was announced on June 26, 2018.[51] Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.[89] Pin and software compatible with Snapdragon 710.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM632[90] 14 nm LPP 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 250 Silver – Cortex-A53 derivative)[54] Adreno 506 (Full HD / Full HD+ / 1920x1200) Hexagon 546 Up to 40 MP camera / 13 MP at 30fps Dual Camera with MFNR/ZSL LPDDR3 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 364 Mbit/s, USB 3.0 3.0 Q3 2018
SDM670[91] 10 nm LPP 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)[92] Adreno 615 (FHD+ / 2560x1600, External up to 4K) Hexagon 685 (3 TOPS) Spectra 250 (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Dual-channel 1866 MHz X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4+ Q3 2018

Snapdragon 662, 665, 675 and 678 (2019/20)

The Snapdragon 675 was announced on October 22, 2018.[93]
The Snapdragon 665 was announced on April 9, 2019.[94][95]
The Snapdragon 662 was announced on January 20, 2020, with NavIC support.[56]
The Snapdragon 678 was announced on December 15, 2020.[96]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6115 (662)[97] 11 nm LPP 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 610 (Full HD+ / 2520x1080) Hexagon 683 Spectra 340T (192 MP camera / 16 MP dual with MFNR/ZSL) LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB 3.1 3.0 Q1 2020
SM6125 (665)[98] Hexagon 686 (3.3 TOPS) Spectra 165 (48 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR3/LPDDR4X
Dual‑channel
up to 1866 MHz 		X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1 Q2 2019
SM6150 (675)[99] 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative)[100] Adreno 612 (FHD+ / 2520x1080, External up to 4K) Hexagon 685 (3 TOPS) Spectra 250L (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Dual-channel 1866 MHz Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4+ Q1 2019
SM6150-AC (678)[101] 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative) Q4 2020

Snapdragon 680 4G, 690 5G and 695 5G (2020/21)

The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G connectivity.[102]
The Snapdragon 680 and 695 were announced on October 26, 2021.[59]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6225 (680)[103] 6 nm N6 (TSMC) 4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 derivative + 1.9 GHz Kryo 265 Silver – Cortex-A53 derivative) Adreno 610 (Full HD+ / 2520x1080) Hexagon 686 (3.3 TOPS) Spectra 346 (64 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac 3.0 Q4 2021
SM6350 (690)[104] 8 nm LPP 2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 derivative + 1.7 GHz Kryo 560 Silver – Cortex-A55 derivative) Adreno 619L (Full HD+@120 Hz; HDR10, HLG) Hexagon 692 (5 TOPS) Spectra 355L (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 900 Mbit/s; LTE: download Cat 18, up to 1.2 Gbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) 4+ H2 2020
SM6375 (695)[105] 6 nm N6 (TSMC) 2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 derivative + 1.7 GHz Kryo 660 Silver – Cortex-A55 derivative) Adreno 619 (Full HD+@120 Hz) Hexagon 686 (3.3 TOPS) Spectra 346T (108 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL / Triple camera: 3x 13 MP at 30 fps with MFNR/ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 1.5 Gbit/s; LTE: download Cat 18, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Q4 2021

Snapdragon 6 Gen 1 (2022)

The Snapdragon 6 Gen 1 was announced on September 6, 2022.[62]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6450 (6 Gen 1)[106] 4 nm LPE (Samsung) 4 + 4 cores (2.2 GHz Kryo Gold – Cortex-A78 derivative + 1.8 GHz Kryo Silver – Cortex-A55 derivative) Adreno (Full HD+@120 Hz) Hexagon Spectra (Single camera: 108 MP, 48 MP at 30fps with MFNR/ZSL / Dual camera: 25 MP + 16 MP at 30fps with MNFR/ZSL / Triple camera: 3x 13 MP at 30 fps with MNFR/ZSL) LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) Internal: X62 5G/LTE (5G: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700, Bluetooth 5.2, NFC, Wi-Fi 6E (802.11ax, 802.11ac, 802.11a/b/g/n 2x2 (MU-MIMO)) 4+ Q1 2023

Snapdragon 7 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 7 series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.[107]

Snapdragon 710 and 712 (2018/19)

The Snapdragon 710 was announced on May 23, 2018.[108] Pin and software compatible with Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.[109]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM710[110] 10 nm LPP 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) Adreno 616 (Quad HD+; HDR) Hexagon 685 (3 TOPS) Spectra 250 (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4 Q2 2018
SDM712[111] 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) 4+[112] Q1 2019

Snapdragon 720G/730/730G/732G (2019/20)

The Snapdragon 730 and 730G were announced on April 9, 2019.[94][113]
The Snapdragon 720G was announced on January 20, 2020.[56]
The Snapdragon 732G was announced on August 31, 2020.[114]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7125 (720G)[115] 8 nm LPP (Samsung) 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 465 Silver – Cortex-A55 derivative) Adreno 618 (Full HD+; HDR10, HLG) Hexagon 692 Spectra 350L (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, NavIC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ Q1 2020
SM7150-AA (730),[116]
SM7150-AB (730G)[117] 		2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative) Adreno 618 (Quad HD+ / 3360x1440; HDR10, HLG) Hexagon 688 Spectra 350 with CV accelerator (192 MP single camera /

22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording

Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q2 2019
SM7150-AC (732G)[118] 2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative) Hexagon 688 (3.6 TOPS) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q3 2020

Snapdragon 750G and 765/765G/768G 5G (2020)

The Snapdragon 765 and 765G were announced on December 4, 2019[119] as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the Play Store.[120]
The Snapdragon 768G was announced on May 10, 2020.[121]
The Snapdragon 750G was announced on September 22, 2020.[122]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7225 (750G)[123] 8 nm LPP (Samsung) 2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 derivative + 1.8 GHz Kryo 570 Silver – Cortex-A55 derivative) Adreno 619 (Full HD+@120 Hz; HDR10, HLG) Hexagon 694 (4.7 TOPS) Spectra 355L (192 MP single camera /

16/32 MP at 30fps dual camera with MFNR/ZSL); HDR10, HLG video recording

LPDDR4X, Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) Internal X52 5G/LTE (5G: download up to 3.7 Gbit/s, upload: up to 1.6 Gbit/s; LTE: download Cat 18, up to 1200 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ Q4 2020
SM7250-AA (765)[124]

SM7250-AB (765G)[125]

7 nm LPP EUV (Samsung) 1 + 1 + 6 cores (2.4 GHz {765G} or 2.3 GHz {765} Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) Adreno 620 (Quad HD+, 700 GFLOPS; HDR10, HLG) Hexagon 696 (5.4 TOPS) Spectra 355 (192 MP single camera /

22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording

Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q1 2020
SM7250-AC (768G)[126] 1 + 1 + 6 cores (2.8 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.4 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q2 2020

Snapdragon 778G/778G+, 780G and 782G 5G (2021/22)

The Snapdragon 780G was announced on March 25, 2021.[127]
The Snapdragon 778G was announced on May 19, 2021.[128]
The Snapdragon 778G+ was announced on October 26, 2021.[59]
The Snapdragon 782G was announced on November 22, 2022.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7325 (778G)[129] 6 nm N6 (TSMC) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78 based) +
3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) +
4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based) 		Adreno 642L (Full HD+@144 Hz; HDR10, HLG, HDR10+) Hexagon 770

(12 TOPs)

Spectra 570L triple-ISP

(1x 200MP, 1x 64MP ZSL, 2x 36+22MP ZSL, 3x 22MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1) 4+ Q2 2021
SM7325-AE (778G+)[130] 1x 2.5 GHz Kryo 670 Prime (Cortex-A78 based) +
3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) +
4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based) 		Q4 2021
SM7350-AB (780G)[131] 5 nm 5LPE (Samsung) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78 based) +
3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) +
4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based) 		Adreno 642 (Full HD+@144 Hz; HDR10, HLG, HDR10+) Spectra 570 triple-ISP

(1x 192MP, 1x 84MP ZSL, 2x 64+20MP ZSL, 3x 25MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) FastConnect 6900 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1) Q1 2021
SM7325-AF (782G)[132] 6 nm N6 (TSMC) 1x 2.7 GHz Kryo 670 Prime (Cortex-A78 based) +
3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) +
4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based) 		Adreno 642L (Full HD+@144 Hz; HDR10, HLG, HDR10+) Spectra 570L triple-ISP

(1x 200MP, 1x 64MP ZSL, 2x 36+22MP ZSL, 3x 22MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) FastConnect 6700 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1) Q4 2022

Snapdragon 7 Gen 1 (2022)

The Snapdragon 7 Gen 1 was announced on May 20, 2022.[133]

Model number Fab CPU (ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7450-AB (7 Gen 1)[134] 4 nm LPE (Samsung) 1x 2.4 GHz Kryo Prime (Cortex-A710 based) + 3x 2.36 GHz Kryo Gold (Cortex-A710 based) + 4x 1.8 GHz Kryo Silver (Cortex-A510 based) Adreno (Full HD+@144 Hz; HDR10, HLG, HDR10+) Hexagon Spectra triple-ISP

(1x 200MP, 1x 84MP ZSL, 2x 64+20MP ZSL, 3x 25MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) Internal: X62 5G/LTE (5G: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4+ Q2 2022

Snapdragon 8 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 8 series

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800, 801 and 805 (2013/14)

The Snapdragon 800 was announced on January 8, 2013.[64]

The Snapdragon 801 was announced on February 24, 2014.[137]
Notable features:[138]

The Snapdragon 805 was announced on November 20, 2013.[140]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8074AA (800)[145] 28 nm HPm (TSMC) 4 cores up to 2.26 GHz Krait 400 Adreno 330 450 MHz (2160p) Hexagon QDSP6 V5 600 MHz Up to 21 MP camera LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) - Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B 2.0 Q2 2013[64]
MSM8274AA (800)[145] Gobi 3G (UMTS)
MSM8674AA (800)[145] Gobi 3G (CDMA/UMTS)
MSM8974AA (800)[145] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3 (801)[138] Gobi 4G (LTE Cat 4) Q3 2014
APQ8074AB v3 (801)[138] 4 cores up to 2.36 GHz Krait 400 Adreno 330 578 MHz[146] (2160p) LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) - Q4 2013
MSM8274AB (800)[145] Gobi 3G (UMTS) Q4 2013[147]
MSM8674AB v3 (801)[138] Gobi 3G (CDMA/UMTS) Q2 2013[64]
MSM8974AB v3 (801)[138][148] Gobi 4G (LTE Cat 4) Q4 2013
MSM8274AC v3 (801)[138] 4 cores up to 2.45 GHz[149] Krait 400[150] Gobi 3G (UMTS) Q2 2014[64]
MSM8974AC v3 (801)[138] Gobi 4G (LTE Cat 4) Q1 2014[64]
APQ8084 (805)[151] 4 cores up to 2.7 GHz Krait 450 Adreno 420 600 MHz (2160p) Hexagon V50 800 MHz Up to 55 MP camera LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s) External Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B Q1 2014

Snapdragon 808 and 810 (2015)

The Snapdragon 808 and 810 were announced on April 7, 2014.[152]

Snapdragon 808 notable features over its predecessor (805):[153]

Snapdragon 810 notable features over its lower end (808):[157]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8992 (808)[153][159] 20 nm (TSMC) 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)[160] Adreno 418 600 MHz[161] Hexagon V56 800 MHz Up to 21 MP camera LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)[162] Bluetooth 4.1; 802.11ac; IZat Gen8C 2.0 Q3 2014[163]
MSM8994 (810)[157][159] 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)[164] Adreno 430 600 MHz Up to 55 MP camera LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994v2[165] Adreno 430 630 MHz[165] 2015[165]
MSM8994v2.1[166] Q2 2015

Snapdragon 820 and 821 (2016)

The Snapdragon 820 was announced at the Mobile World Congress in March 2015,[167] with the first phones featuring the SoC released in early 2016.[168][169] The Snapdragon 821 was announced in July 2016.[170] The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.[170]

Notable features over its predecessor (Snapdragon 808 and 810):[167]

The Snapdragon 821 was announced on August 16, 2016.[175]

Notable features over its predecessor (Snapdragon 820):

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8996 Lite (820)[176] 14 nm FinFET LPP (Samsung) 2 + 2 cores (1.804 GHz + 1.363 GHz Kryo) Adreno 530 510 MHz (407.4 GFLOPS) Hexagon 680 1 GHz Spectra (Up to 28 MP camera / 13 MP dual) LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s) X12 LTE (download: Cat 12,

up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)

Bluetooth 4.1; 802.11ac/ad; IZat Gen8C 3.0 Q1 2016
MSM8996 (820)[176] 2 + 2 cores (2.15 GHz + 1.593 GHz Kryo) Adreno 530 624 MHz (498.5 GFLOPS) LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Q4 2015
MSM8996 Pro-AB[177][178] (821) Q3 2016
MSM8996 Pro-AC[177][178][179] (821) 2 + 2 cores (2.342 GHz + 1.6/2.188 GHz Kryo) Adreno 530 653 MHz (519.2 GFLOPS)

Snapdragon 835 (2017)

The Snapdragon 835 was announced on November 17, 2016.[180]

Notable features over its predecessor (821).

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8998 (835)[185] 10 nm FinFET LPE (Samsung) 4 + 4 cores (2.45 GHz + 1.9 GHz Kryo 280) Adreno 540 710/670 MHz (737/686 GFLOPS) Hexagon 682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4.0 Q2 2017[186]

Snapdragon 845 (2018)

The Snapdragon 845 was announced on December 7, 2017.[187][188]

Snapdragon 845's notable features:[189][190][191]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM845[189] 10 nm
FinFET LPP
(Samsung) 		4 + 4 cores (2.8 GHz Kryo 385 Gold+ 1.8 GHz Kryo 385 Silver) Adreno 630 710 MHz (737 GFLOPS) Hexagon 685

(3 TOPs)

Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4+ Q1 2018

Snapdragon 855/855+ (2019) and 860 (2021)

The Snapdragon 855 was announced on December 5, 2018.[197][198] The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.

Notable features over its predecessor (845):

The Snapdragon 855+ was announced on July 15, 2019.[209]

The Snapdragon 860 was announced on March 22, 2021.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8150 (855)[210] 7 nm N7 (TSMC) 1x 2.84 GHz Kryo 485 Prime (Cortex-A76 based) +

3x 2.42 GHz Kryo 485 Gold (Cortex-A76 based) +

4x 1.8 GHz Kryo 485 Silver (Cortex-A55 based)

Adreno 640

585 MHz (954.7 GFLOPS)

Hexagon 690

(7 TOPs)

Spectra 380

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit)

2133 MHz

(34.13 GB/s)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X50 5G[211] (5G only: download up to 5 Gbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1, UFS 3.0 4+ Q1 2019
SM8150-AC (855+)[212] Kryo 485

1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz)

Adreno 640

~675 MHz (1037 GFLOPS)

Q3 2019
SM8150P (855+) Internal: no

+

External: X55 (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)

Q3 2019
SM8150-AC (860)[212] Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X50 5G[211] (5G only: download up to 5 Gbit/s)

Q1 2021

Snapdragon 865/865+ 5G (2020) and 870 5G (2021)

The Snapdragon 865 was announced on December 4, 2019.[213]

Notable features over its predecessor (855):[214]

The Snapdragon 865+ was announced on July 8, 2020.[219]

The Snapdragon 870 was announced on January 19, 2021.[220]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8250 (865)[221] 7 nm N7P (TSMC) Kryo 585

1 + 3 + 4 cores (2.84 GHz + 2.42 GHz + 1.80 GHz)

Adreno 650 587 MHz (1202.1 GFLOPs in FP-32) Hexagon 698

(15 TOPs)

Spectra 480 LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or
LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) 		Internal: no

+
External : X55 5G/LTE[222] (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)

FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4+ Q1 2020
SM8250-AB (865+)[223] Kryo 585

1 + 3 + 4 cores (3.1 GHz + 2.42 GHz + 1.80 GHz)

Adreno 650 670 MHz (1372.1 GFLOPs in FP-32) FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q3 2020
SM8250-AC (870)[224] Kryo 585

1 + 3 + 4 cores (3.2 GHz + 2.42 GHz + 1.80 GHz)

FastConnect 6800; Bluetooth 5.2;[225] 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q1 2021

Snapdragon 888/888+ 5G (2021)

The Snapdragon 888 was announced on December 1, 2020.[226][227][228][229][230]

Notable features over its predecessor (865):

The Snapdragon 888+ was announced on June 28, 2021.[236]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8350 (888)[237] 5 nm 5LPE (Samsung) 1x 2.84 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based) Adreno 660 840 MHz (1720.3 GFLOPs in FP32) Hexagon 780

(26 TOPs)

Spectra 580 LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X60 5G/LTE (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 5 Q1 2021
SM8350-AC (888+)[238] 1x 3.0 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based) Hexagon 780

(32 TOPs)

Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021.[239][240]

Notable features over its predecessor (888):

The Snapdragon 8+ Gen 1 was announced on May 20, 2022.[133]

Model number Fab CPU (ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8450 (8 Gen 1)[240] 4 nm 4LPE (Samsung) 1x 3.0 GHz Kryo Prime (Cortex-X2 based) + 3x 2.5 GHz Kryo Gold (Cortex-A710 based) + 4x 1.8 GHz Kryo Silver (Cortex-A510 based) Adreno 730 818 MHz (2236.1 GFLOPs in FP-32) Hexagon
52 TOPS, some cases up to 104 TOPS 		Spectra LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 5 Q4 2021 [244]
SM8475 (8+ Gen 1)[245] 4 nm N4 (TSMC) 1x 3.2 GHz Kryo Prime (Cortex-X2 based) + 3x 2.75 GHz Kryo Gold (Cortex-A710 based) + 4x 2.0 GHz Kryo Silver (Cortex-A510 based) Adreno 730 900 MHz Q2 2022 [246]

Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022.[247]

Notable features over its predecessor (8 Gen 1):

Model number Fab CPU (ARMv9) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Released
SM8550-AB [248]

(8 Gen 2)

4 nm N4 (TSMC) 1× 3.2 GHz Kryo Prime (Cortex-X3 based) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710 based) + 3× 2.0 GHz Kryo Silver (Cortex-A510 based) Adreno 740 680 MHz (3481.6 GFLOPS in FP32) Hexagon Spectra LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz Internal: X70 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 5 Q4 2022[247]
SM8550-AC

(Custom 8 Gen 2)

1× 3.36 GHz Kryo Prime (Cortex-X3 based) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710 based) + 3× 2.0 GHz Kryo Silver (Cortex-A510 based) Adreno 740

719 MHz (3681.28 GFLOPS in FP32)

Hexagon Spectra LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz Internal: X70 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 5 Q1 2023

Mobile Compute Platforms

Further information: Devices using Qualcomm Snapdragon processors § Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.[187]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.[249] It is essentially an over-clocked version of the Snapdragon 845.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8998 (835)[250] 10 nm FinFET LPE (Samsung) Kryo 280 4 + 4 cores

(2.6 GHz + 1.9 GHz)

Adreno 540 710/670 MHz (737/686 GFLOPS) Hexagon 682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4 Q2 2018
SDM850 (850)[251] 10 nm
FinFET LPP
(Samsung) 		Kryo 385 4 + 4 cores

(2.95 GHz + 1.8 GHz)

Adreno 630 710 MHz (737 GFLOPS) Hexagon 685

(3 TOPs)

Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ Q3 2018

Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[252]
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.[253]
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.[254]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC7180 (7c)[255] 8 nm LPP (Samsung) Kryo 468 2 + 6 cores

(up to 2.4 GHz)

Adreno 618 Hexagon 692 (5 TOPS) Spectra 255 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad/ax; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 Q1 2020
SC7180P
(7c Gen 2)[256] 		Kryo 468 2 + 6 cores

(up to 2.55 GHz)

Q2 2021
7c+ Gen 3[257] 6 nm N6 (TSMC) Kryo
8 core 		Adreno Hexagon (6.5 TOPS) Spectra (64 MP single camera / 36+22 MP dual camera) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)
LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) 		Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD Q1 2022

Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[252]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC8180 (8c)[258] 7 nm (TSMC N7) Kryo 490 4 + 4 cores

(2.45 GHz + 1.80 GHz)

Adreno 675 Hexagon 690

(9 TOPs)

Spectra 390

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X55 5G/LTE[222] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4+ Q1 2020

Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.[259][260]
Notable features over the Snapdragon 855:

The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.[261]
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.[254]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SC8180X (8cx)[262] 7 nm (TSMC N7) Kryo 495 4 + 4 cores

(2.84 GHz + 1.80 GHz)

Adreno 680 585 MHz (1842.5 GFLOPS) Hexagon 690

(9 TOPs)

Spectra 390

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.26 GB/s)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X55 5G/LTE[222] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4+ Q3 2019
SC8180XP (8cx Gen 2)[263] Kryo 495 4 + 4 cores

(3.15 GHz + 1.8 GHz)

Adreno 690 660 MHz (2078.7 GFLOPS) Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD Q3 2020
SC8280 (8cx Gen 3)[264] 5 nm LPE (Samsung) Kryo 680 4 + 4 cores

(3.0 GHz + 2.4 GHz)

Adreno Hexagon (29 TOPS) Spectra (24 MP at 30fps single camera with MFNR/ZSL) LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.26 GB/s) Internal: X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD Q1 2022

Microsoft SQ1, SQ2 and SQ3

Further information: Devices using Qualcomm Snapdragon processors § SQ

The Microsoft SQ1 was announced on October 2, 2019.[265][266] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.[267]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
Microsoft SQ1 7 nm

(TSMC N7)

Kryo 495 4 + 4 cores

(3 GHz + 1.80 GHz)

Adreno 685 (2100 GFLOPs) Hexagon 690 Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.26 GB/s)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4+ Q3 2019
Microsoft SQ2 Kryo 495 4 + 4 cores

(3.15 GHz + 2.42 GHz)

Adreno 690 Q3 2020
Microsoft SQ3[268][269] 5 nm LPE (Samsung) Kryo 680 4 + 4 cores

(3.0 GHz + 2.4 GHz)

Adreno Hexagon (29 TOPS) Spectra (24 MP at 30fps single camera with MFNR/ZSL) Internal: X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD Q3 2022

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

Snapdragon Wear series

The Snapdragon Wear 1100 processor was announced May 30, 2016[270] for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1100 processor was announced June 27, 2017[271] for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.[272] It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.[273] It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.[274] The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.[275] The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.[276] The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model number Product Name Fab CPU Co-processor GPU DSP Memory technology Modem Connectivity Sampling availability
? Wear 1100[277] 28 nm 1 core up to 1.2 GHz Cortex-A7 (ARMv7) — Fixed Function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2016[278]
Wear 1200[279] 1 core up to 1.3 GHz Cortex-A7 (ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2017[280]
MSM8909w[281] Wear 2100[282] 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) Adreno 304 Hexagon LPDDR3 400 MHz X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou Q1 2016[283]
Wear 2500[284] Q2 2018
Wear 3100[285] QCC1110 (1 core 50 MHz Cortex-M0) Q3 2018[286]
SDM429w Wear 4100 and 4100+[287] 12 nm + 28 nm 4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A) Adreno A504 320 MHz Hexagon QDSP6 V56 1x32 bit LPDDR3 750 MHz Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q2 2020[288]
SW5100 W5 and W5+ Gen 1[289] 4 nm + 22 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) Adreno A702 1 GHz Hexagon DSP V66K 1x16 bit LPDDR4 2133 MHz Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q3 2022[290]
  1. ^ Bluetooth 4.2 for Wear 3100

Automotive platforms

Snapdragon 602A, 820A and 855A

The Snapdragon 602A,[291] for application in the motor industry,[292] was announced on January 6, 2014.
The Snapdragon 820A[293] was announced on January 6, 2016.

Model number Fab CPU GPU DSP Memory technology Modem Connectivity Sampling availability
8064-AU (602A)[294] 28 nm LP 4 cores up to 1.5 GHz Krait 300 (ARMv7) Adreno 320 (2048x1536 + 1080p external display) Hexagon V40 600 MHz LPDDR3 Dual-channel 32-bit 533 MHz External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS) Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 2-stream 802.11n/ac Q1 2014
MSM8996AU (820A)[295] 14 nm FinFET LPP (Samsung) 4 cores up to 2.1 GHz Kryo (ARMv8) Adreno 530
 Hexagon 680 1 GHz LPDDR4 X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1; 802.11ac/ad; IZat Gen8C
SA8155P (855A) 7 nm (TSMC N7) Kryo 485 1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz) Adreno 640
 Hexagon 690 LPDDR4X Internal: no Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS

Embedded platforms

Snapdragon 410E, 600E, 800, 810 and 820E

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[296][297]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[298]

Model number Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8016E (410E)[299] 28 nm LP 4 cores up to 1.2 GHz Cortex-A53 (ARMv8) Adreno 306 Hexagon QDSP6 V5 691 MHz Up to 13 MP camera LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) none Bluetooth 4.0, 802.11n, GPS
APQ8064E (600E)[300] 4 cores up to 1.5 GHz Krait 300 (ARMv7) Adreno 320 400 MHz Hexagon QDSP6 V4 500 MHz Up to 21 MP camera DDR3/DDR3L Dual-channel 533 MHz Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074 (800)[301] 28 nm HPm 4 cores up to 2.3 GHz Krait 400 (ARMv7) Adreno 330
 Hexagon QDSP6 V5 Up to 55 MP camera LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094 (810)[302] 20 nm (TSMC) 4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8) Adreno 430 650 MHz Hexagon V56 800 MHz Up to 55 MP camera LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096 (820E)[303] 14 nm FinFET LPP (Samsung) 2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8) Adreno 530 Hexagon 680 825 MHz Up to 28 MP camera LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform[304] was announced on April 11, 2018.[305][306] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
QCS603[307] 10 nm LPP 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display) Hexagon 685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHz none Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+
QCS605[308] 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms

Qualcomm 212, 624 and Smart Audio

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[309] was announced on June 14, 2017.[310]
The Qualcomm 212 Home Hub (APQ8009)[311] and Qualcomm 624 Home Hub (APQ8053)[312] were announced on January 9, 2018.[313]

The QCS400 Series was announced March 19, 2019.[314]

Model number Fab CPU GPU DSP ISP Audio Memory technology Modem Connectivity Sampling availability
APQ8009[315][309] (SDA212)[316] 28 nm LP 4 cores up to 1.3 GHz Cortex-A7 (ARMv7) Adreno 304 (HD) Hexagon 536 Up to 16 MP camera LPDDR2/3 Single-Channel 533 MHz none Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017[309] 4 cores up to 1.4 GHz Cortex-A53 (ARMv8) Adreno 308 (Full HD) LPDDR3 Single-channel 667 MHz
APQ8053[317] (SDA624)[318] 14 nm LPP 8 cores up to 1.8 GHz Cortex-A53 (ARMv8) Adreno 506 (Full HD+) Hexagon 546 Up to 24 MP camera / 13 MP dual LPDDR3
QCS403[319] Dual-core CPU none 2x Hexagon V66 12x Audio Channels Supported Bluetooth 5.1;

802.11ax-ready, 802.11ac, 4x4 (MIMO);

Zigbee/15.4

Q1 2019
QCS404[320] Quad-core CPU
QCS405[321] Adreno 306 (Full HD+)
QCS407[322] 32x Audio Channels Supported

eXtended Reality (XR) platforms

Snapdragon XR1 and XR2

In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.[323]
The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865.[324][failed verification][325] It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022,[326] and is used in the Meta Quest Pro.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Tracking Connectivity Sampling availability
XR1[327] Samsung 10nm LPP 4x Kryo 385 Gold

4x Kyro 385 Silver

Adreno 615 Hexagon 685 Spectra LPDDR4X 3DoF and 6DoF head and controller tracking WiFi 5 Bluetooth 5 Q1 2019
XR2[328] TSMC 7nm+ 1x Kryo 585 Prime

3x Kyro 585 Gold

4x Kyro 585 Silver

Adreno 650

(up to 2x 3K displays at 90  Hz)

Hexagon 698 Spectra

(input from up to 7 cameras)

LPDDR4X Full 6DoF head and controller tracking, as well as hand and finger tracking WiFi 6 Bluetooth 5 5G Q1 2020

Gaming platforms

Snapdragon G3x Gen 1

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform, a purpose-built SoC designed for dedicated gaming devices. Qualcomm also announced a handheld gaming developer kit developed with Razer.[329]

Specifications:[330]

Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.[331][332] Qualcomm announced the QCC5100 Series at CES 2018.[333]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[334][335] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[336] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.[337][338]

Qualcomm QCC300x Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Sampling availability
QCC3001[339] RISC application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP (Up to 80 MHz) Bluetooth 5.0

Dual-mode Bluetooth

TrueWireless Stereo

cVc audio

Mono / 2-mic
QCC3002[340] TrueWireless Stereo

aptX Classic/HD/LL

cVc audio

QCC3003[341] cVc audio Stereo / 1-mic
QCC3004[342] Stereo / 2-mic
QCC3005[343] aptX Classic/HD/LL

cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital Assistant activation Sampling availability
QCC3020[344] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

~6mA (2DP streaming) Mono / 2-mic Button press H1 2017
QCC3021[345] Stereo / 1-mic
QCC3024[346] cVc audio

Google Fast Pair

Stereo / 2-mic
QCC3026[347] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Mono / 2-mic
QCC3031[348] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Stereo / 1-mic
QCC3034[349] aptX Classic/HD/LL

cVc audio

Google Fast Pair

Mono / 2-mic
QCC3040[350] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[334][335] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

<5 mA Stereo / 2-mic Button press H1 2020
QCC3046[351] <5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital Assistant activation Sampling availability
QCC5120[352] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

Button press

Qualcomm® Voice Activation

H1 2018
QCC5121[353]
QCC5124[354]
QCC5125[355] Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

Button press
QCC5141[356] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[334][335] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~5mA A2DP stream Button press

Qualcomm® Voice Activation

H1 2020
QCC5144[357]

Related pages

See also

Similar platforms

References

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