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Multibeam Corporation
IndustrySemiconductor industry
Founded2010; 14 years ago (2010)
HeadquartersSanta Clara, California
Key people
David K. Lam (Chairman)
ProductsE-beam lithography systems for the semiconductor industry
Websitehttp://www.multibeamcorp.com

Multibeam is an American corporation that engages in the design, manufacture, and sale of semiconductor processing equipment used in the fabrication of integrated circuits. Headquartered in Santa Clara, in the Silicon Valley, Multibeam is led by Dr. David K. Lam, the founder and first CEO of Lam Research.

Technology

Multibeam developed miniature, all-electrostatic columns for e-beam lithography, that provide a mask-less and high throughput platform for writing nanoscale IC patterns seamlessly across full wafers. Arrays of e-beam columns operate simultaneously and in parallel to increase wafer processing speed. With over 35 patents issued,[1] these multi-column e-beam lithography (MEBL) systems enable an array of direct write lithography applications, including Complementary E-Beam Lithography (CEBL), Secure Chip ID, Advanced Packaging Interposers, Photonics, and other applications where precise, nanometer-scale features are required.[1]

Applications

References

  1. ^ a b "Multibeam Patents Direct Deposition & Direct Etch". Solid State Technology. November 14, 2016.
  2. ^ "1D design style implications for mask making and CEBL". SPIE. September 9, 2013.
  3. ^ "From the White Board". eBeam Initiative. June 2014.
  4. ^ Liu, Enden D.; Tran, Cong; Prescop, Ted; Lam, David K. (March 21, 2012). "Multiple columns for high-throughput complementary e-beam lithography (CEBL)". In Tong, William M. (ed.). Alternative Lithographic Technologies IV. Vol. 8323. SPIE. doi:10.1117/12.916118. S2CID 121931138.
  5. ^ Lam, David K.; Liu, Enden D.; Smayling, Michael C.; Prescop, Ted (April 4, 2011). "E-beam to complement optical lithography for 1D layouts". In Herr, Daniel J. C. (ed.). Alternative Lithographic Technologies III. Vol. 7970. SPIE. p. 797011. doi:10.1117/12.879479. S2CID 55079236.
  6. ^ Lam, David; Liu, Dave; Prescop, Ted (September 29, 2010). "E-beam direct write (EBDW) as complementary lithography". In Montgomery, M. Warren; Maurer, Wilhelm (eds.). Photomask Technology 2010. Vol. 7823. SPIE. pp. 78231C. doi:10.1117/12.868485. S2CID 109918356.
  7. ^ "Securing Chips During Manufacturing". Semiconductor Engineering. July 7, 2016.
  8. ^ "Tech Talk". eBeam Initiative. October 2016.
  9. ^ MacWilliams, Kenneth; Lam, David K.; Prescop, Ted; Van Art, Roger (October 25, 2022). "Enabling Next-Generation Space Systems with High Productivity Electron Beam Lithography". Ascend 2022. Aerospace Research Center. doi:10.2514/6.2022-4298. ISBN 978-1-62410-662-0. S2CID 252925482.

External links

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