A surface-mount IC in the MSOP form-factor
A surface-mount IC in the MSOP form-factor

The Mini Small Outline Package (MSOP) a miniaturized version of the Shrink Small Outline ic package .

Application

They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.[1]

Physical properties

The size of the Mini Small Outline Package is only 3mm x 3mm for the 8 & 10 pins[1] version and 3mm x 4mm for the 12 & 16 pins version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]

Part number Pins Body width (mm) Body length (mm) Lead pitch (mm)
MSOP8 8 3 3 0.65
MSOP10 10 3 3 0.5
MSOP12 12 3 4 0.65
MSOP16 16 3 4 0.5

Synonyms for the MSOP Package

Similar package types

See also

List of integrated circuit packaging types

References

  1. ^ a b c d "MSOP in STATS ChipPAC datasheet". Retrieved 8 December 2020.
  2. ^ a b c d e "MSOP on mbedded.ninja". blog.mbedded.ninja. Retrieved 8 December 2020.
  3. ^ "MSOP on EESemi.com". eesemi.com. Retrieved 8 December 2020.
  4. ^ a b "Package Information - Maxim Integrated". www.maximintegrated.com. Retrieved 2021-01-04.