HiSilicon Co., Ltd.
Native name
海思半导体有限公司;上海海思
TypeSubsidiary
IndustryFabless semiconductors, Semiconductors, Integrated circuit design
Founded1991; 31 years ago (1991)[1][citation needed]
HeadquartersShenzhen, Guangdong, China
ProductsSoCs
BrandsKirin

Gigahom

Kunpeng

Balong

Ascend
ParentHuawei
Websitewww.hisilicon.com/en
HiSilicon
Simplified Chinese海思半导体有限公司
Traditional Chinese海思半導體有限公司
Literal meaningHaisi Semiconductor Limited Company

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[2][3] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.[4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[6] In 2020, the U.S. instituted rules that require American firms providing certain equipment to HiSilicon or non-American firms who use American technologies that supply HiSilicon to have licenses[7] and Huawei announced it will stop producing its Kirin chipset from 15 September 2020, onwards.[8] HiSilicon has since been overtaken by Chinese rival UNISOC in terms of mobile processor market share.[9]

Branch

HiSilicon (Shanghai) Technologies CO., Ltd

HiSilicon (Shanghai) Technologies CO., Ltd is a fabless semiconductor and IC design company, providing comprehensive connectivity and multimedia chipset solutions to the market. The company also paves the way for innovations in networking and ultra-HD video technologies. Its chipset solutions service for high-speed communications, smart devices, and IoT to video applications, etc.[10]

HiSilicon Technologies Co Ltd

HiSilicon Technologies Co. Ltd. manufactures semiconductor products. The Company designs, develops, produces, and provides network monitoring chips, video-phone chips, and other chips for wireless networks, fixed networks, and digital media fields. HiSilicon Technologies also offers technology solutions.[11]

History

Shenzhen HiSilicon Semiconductor Co., Ltd. was Huawei's ASIC Design Center, which was founded in 1991. After more than 10 years of development, HiSilicon has grown into an independent chip supplier that can provide customers with wireless terminal solutions, optical network solutions, digital media solutions, digital TV solutions and communication network solutions. By the end of 2005, a total of more than 100 chip designs have been completed, of which more than 60 have been mass-produced and are widely used in various communication network products.

Smartphone application processors

HiSilicon Hi6250
HiSilicon Hi6250

HiSilicon develops SoCs based on ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[14] and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[15] The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.4 Vivante GC4000 240 MHz

(15.3GFlops)

LPDDR2 64-bit dual-channel 7.2 (up to 8.5) Q1 2012
List

K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2E (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 240 MHz

(15.3GFlops)

LPDDR2 64-bit dual-channel 7.2 (up to 8.5) 2013
List
  • Huawei Honor 3

Kirin 620

• supports – USB 2.0 / 13 MP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 620 (Hi6220)[16] 28 nm ARMv8-A Cortex-A53 8[17] 1.2 Mali-450 MP4 500 MHz (32GFlops) LPDDR3 (800 MHz) 32-bit single-channel 6.4 Dual SIM LTE Cat.4 (150 Mbit/s) Q1 2015
List

Kirin 650, 655, 658, 659

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 650 (Hi6250) 16 nm FinFET+ ARMv8-A Cortex-A53
Cortex-A53
4+4 2.0 (4xA53) 1.7 (4xA53) Mali-T830 MP2 900 MHz

(40.8GFlops)

LPDDR3 (933 MHz) 64-bit dual-channel (2x32bit)[18] A-GPS, GLONASS Dual SIM LTE Cat.6 (300 Mbit/s) 802.11 b/g/n Bluetooth v4.1 Q2 2016
List
  • Huawei P9 Lite, Honor 5C
Kirin 655 2.12 (4xA53) 1.7 (4xA53) Q4 2016
List
Kirin 658 2.35 (4xA53) 1.7 (4xA53) 802.11 b/g/n/ac Q2 2017
List
  • P10 Lite
Kirin 659 2.36 (4xA53) 1.7 (4xA53) 802.11 b/g/n Bluetooth v4.2 Q3 2017
List
  • Nova 2,
  • Nova 2 Plus,
  • Nova 2i,
  • Nova 3e,
  • Maimang 6,
  • Honor 7X (2017) – India,
  • P20 Lite,
  • Honor 9 Lite,
  • Huawei P Smart,
  • Huawei MediaPad M5 lite,
  • Huawei MediaPad T5

Kirin 710

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 710 (Hi6260) TSMC 12 nm FinFET ARMv8-A Cortex-A73
Cortex-A53
4+4 2.2 (A73)

1.7 (A53)

Mali-G51 MP4 1000 MHz LPDDR3 LPDDR4 32-bit A-GPS, GLONASS Dual SIM LTE Cat.12 (600 Mbit/s) 802.11 b/g/n Bluetooth v4.2 Q3 2018
List
  • Huawei Nova 3i, Honor 10 Lite, Huawei P Smart+, Huawei P Smart 2019, Huawei Mate 20 Lite, Honor 8X, Huawei Y9 (2019), Huawei P30 Lite,Huawei Y9 Prime 2019,Huawei Y9s,Huawei Mate 20 Lite,Huawei P30 Lite,Honor 20i
Kirin 710F[19]
List
  • Honor 9X, Huawei P40 lite E, Huawei Y8p
Kirin 710A SMIC 14 nm FinFET[20] 2.0 (A73)

1.7 (A53)

List
  • Honor Play 4T, Huawei P smart 2021

Kirin 810 and 820

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 810 (Hi6280) 7 nm FinFET ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ
2+6 2.27 (2xA76)
1.9 (6xA55)
Mali-G52 MP6 820 MHz LPDDR4X (2133 MHz) 64-bit (16-bit quad-channel) 31.78 A-GPS, GLONASS, BDS Dual SIM LTE Cat.12 (600 Mbit/s) 802.11 b/g/n/ac Bluetooth v5.0 Q2 2019
List
    • Huawei Nova 5
    • Huawei Honor 9x
    • Huawei Honor 9x Pro
    • Huawei Mate 30 Lite
    • Huawei P40 Lite
    • Huawei Nova 7i
    • Huawei nova 6 SE
    • Huawei P smart Pro 2019
    • Huawei nova 5z
    • Huawei nova 5i Pro
    • Huawei Honor 20S
    • Huawei MatePad 10.4
Kirin 820 5G (1+3)+4 2.36 (1xA76 H)
2.22 (3xA76 L)
1.84 (4xA55)
Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2020
List
  • Honor 30S
  • Honor X10 5G
Kirin 820E 5G 3+3
2.22 (4xA76 L)
1.84 (4xA55)
Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2021

Kirin 910 and 910T

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 910 (Hi6620) 28 nm HPM ARMv7 Cortex-A9 4 1.6 Mali-450 MP4 533 MHz

(32GFlops)

LPDDR3 32-bit single-channel 6.4 LTE Cat.4 H1 2014
List
  • HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1,[21] Huawei P6 S,[22] Huawei MediaPad M1,[23] Huawei Honor 3C 4G
Kirin 910T 1.8 700 MHz

(41.8GFlops)

H1 2014
List
  • Huawei Ascend P7

Kirin 920, 925 and 928

• The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 920 28 nm HPM ARMv7 Cortex-A15
Cortex-A7
big.LITTLE
4+4 1.7 (A15)
1.3 (A7)
Mali-T628 MP4 600 MHz

(76.8GFlops)

LPDDR3 (1600 MHz) 64-bit dual-channel 12.8 LTE Cat.6 (300 Mbit/s) H2 2014
Kirin 925 (Hi3630) 1.8 (A15)
1.3 (A7)
Q3 2014
List
Kirin 928 2.0 (A15)
1.3 (A7)
List
  • Huawei Honor6 extreme Edition

Kirin 930 and 935

• supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 930 (Hi3635) 28 nm HPC ARMv8-A Cortex-A53
Cortex-A53
4+4 2.0 (A53)
1.5 (A53)
Mali-T628 MP4 600 MHz

(76.8GFlops)

LPDDR3 (1600 MHz) 64-bit(2x32-bit) Dual-channel 12.8 GB/s Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) Q1 2015
List
  • Huawei MediaPad X2,
  • Huawei P8,
  • Huawei MediaPad M2,
Kirin 935 2.2 (A53)
1.5 (A53)
680 MHz

(87GFlops)

Q1 2015
List

Kirin 950 and 955

• supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 950 (Hi3650) TSMC 16 nm FinFET+[25] ARMv8-A Cortex-A72
Cortex-A53
big.LITTLE
4+4 2.3 (A72)
1.8 (A53)
Mali-T880 MP4 900 MHz

(168 GFLOPS FP32)

LPDDR4 64-bit(2x32-bit) Dual-channel 25.6 Dual SIM LTE Cat.6 Q4 2015
List
  • Huawei Mate 8, Huawei Honor V8 32GB, Huawei Honor 8, Huawei Honor Magic, Huawei MediaPad M3 (BTV-W09)[26]
Kirin 955[27] 2.5 (A72)
1.8 (A53)
LPDDR3 (3 GB) LPDDR4 (4 GB) Q2 2016
List
  • Huawei P9, Huawei P9 Plus, Honor Note 8, Honor V8 64GB

Kirin 960

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 960 (Hi3660)[28] TSMC 16 nm FFC ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE
4+4 2.36 (A73)
1.84 (A53)
Mali-G71 MP8 1037 MHz

(192 GFLOPS FP32)

LPDDR4-1600 64-bit(2x32-bit) Dual-channel 28.8 Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO Q4 2016
List

Kirin 970

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 970 (Hi3670) TSMC 10 nm FinFET+ ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE
4+4 2.36 (A73)
1.84 (A53)
Mali-G72 MP12 746 MHz

(288 GFLOPS FP32)

LPDDR4X-1866 64-bit(4x16-bit) Quad-channel 29.8 Galileo Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMO Q4 2017
List

Kirin 980 and Kirin 985 5G/4G

Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.

Kirin 985 5G is the second Hislicon's 5G SoC based on 7 nm FinFET Technology.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 980 TSMC 7 nm FinFET ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ
(2+2)+4 2.6 (A76 H)
1.92 (A76 L)
1.8 (A55)
Mali-G76 MP10 720 MHz

(480 GFLOPS FP32)[31]

LPDDR4X-2133 64-bit(4x16-bit) Quad-channel 34.1 Galileo Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMO Q4 2018
List
Kirin 985 5G/4G (Hi6290) (1+3)+4 2.58 (A76 H)
2.40 (A76 L)
1.84 (A55)
Mali-G77 MP8 700 MHz Balong 5000 (Sub-6 GHz only; NSA & SA), 4G version available Q2 2020
List
  • Honor 30
  • Honor V6
  • Huawei nova 7 5G
  • Huawei nova 7 Pro 5G
  • Huawei nova 8 5G
  • Huawei nova 8 Pro 5G

Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G

Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.[32]

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 990 4G TSMC 7 nm FinFET (DUV) ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ
(2+2)+4 2.86 (A76 H)
2.09 (A76 L)
1.86 (A55)
Mali-G76 MP16 600 MHz
(768 GFLOPS FP32)
LPDDR4X-2133 64-bit(4x16-bit) Quad-channel 34.1 Galileo Balong 765 (LTE Cat.19) Q4 2019
List
Kirin 990 5G TSMC 7 nm+ FinFET (EUV) 2.86 (A76 H)
2.36 (A76 L)
1.95 (A55)
Balong 5000 (Sub-6-GHz only; NSA & SA)
List
  • Huawei Mate 30 5G
  • Huawei Mate 30 Pro 5G
  • Huawei Mate 30 RS Porche Design
  • Huawei P40
  • Huawei P40 Pro
  • Huawei P40 Pro+
  • Honor V30 Pro
  • Huawei MatePad Pro 5G (2020)
  • Honor 30 Pro
  • Honor 30 Pro+
Kirin 990E 5G Mali-G76 MP14 ? Q4 2020
List
  • Huawei Mate 30E Pro 5G
  • Huawei Mate 40E (4G/5G)

Kirin 9000 5G/4G and Kirin 9000E

Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV) TSMC technology and the first 5 nm SoC to be launched on the international market.[34] This octa-core system on a chip is equipped with 15.3 billion of transistors in a 1+3+4 configuration: 4 Arm Cortex-A77 CPU (1x 3,13 GHz and 3x 2,54 GHz), 4 Arm Cortex-A55 (4x 2,05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) with Kirin Gaming+ 3.0 implementation.[34] The integrated quad pipeline NPU (Dual Big Core + 1 Tiny Core configuration) is equipped with a Kirin ISP 6.0 to support advanced computational photography. The Huawei Da Vinci Architecture 2.0 for AI supports 2x Ascend Lite + 1x Ascend Tiny (only 1 Lite in 9000E). The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series). Due to the integrated 3rd generation 7 nm TSMC 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA, Sub-6G and mmWave connectivity.[34] The SoC TDP is 6W.

The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 9000E TSMC 5 nm+ FinFET (EUV) ARMv8.2-A Cortex-A77
Cortex-A55
DynamIQ
(1+3)+4 3.13 (A77 H)
2.54 (A77 L)
2.05 (A55)
Mali-G78 MP22 759 MHz (192 EUs, 1536 ALUs) (2137.3 GFLOPS FP32) LPDDR4X-2133
LPDDR5-2750
64-bit(4x16-bit) Quad-channel 34.1 (LPDDR4X)
44 (LPDDR5)
Galileo Balong 5000 (Sub-6-GHz only; NSA & SA), 4G version available Q4 2020
List
Kirin 9000 5G/4G Mali-G78 MP24 759 MHz (192 EUs, 1536 ALUs) (2331.6 GFLOPS FP32)
List
  • Huawei Mate 40 Pro
  • Huawei Mate 40 Pro+
  • Huawei Mate 40 RS Porsche Design
  • Huawei P50 Pro
  • Huawei Mate X2

Smartphone modems

HiSilicon develops smartphone modems which although not exclusively, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

Balong 700

The Balong 700 supports LTE TDD/FDD.[35] Its specs:

Balong 710

At MWC 2012 HiSilicon released the Balong 710.[36] It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710 was designed to be used with the K3V2 SoC. Its specs:

Balong 720

The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate.[35] Its specs:

Balong 750

The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and 3.5 GHz.[35] Its specs:

Balong 765

The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network.[37] Its specs:

Balong 5G01

The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave (mmWave).[35] Its specs:

Balong 5000

The Balong 5000 is the world's first 7 nm TSMC 5G multi-mode chipset (launched in Q1 2019), the world's first SA/NSA implementation and the first smartphone chipset to support the full NR TDD/FDD spectrum.[38] The modem have an advanced 2G, 3G, 4G, and 5G connectivity.[39] Its specs:

Wearable SoCs

HiSilicon develops SoCs for wearables such as truly wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear and smartwatches.[41]

Kirin A1

The Kirin A1 was announced on 6 September 2019.[41] It features:

Server processors

HiSilicon develops server processor SoCs based on ARM architecture.

Hi1610

The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:

Hi1612

The Hi1612 is HiSilicon's second generation server processor launched in 2016. It features:

Kunpeng 916 (formerly Hi1616)

The Kunpeng 916 (formerly known as Hi1616) is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server.[44][45][46][47] It features:

Kunpeng 920 (formerly Hi1620)

The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, launched in 2019. Huawei claim the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006.[48] The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server and TaiShan XA320 V2 High-Density Server Node.[49][50][51] It features:

Kunpeng 930 (formerly Hi1630)

The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021. It features:

Kunpeng 950

The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.

AI acceleration

HiSilicon also develops AI Acceleration chips.

Da Vinci architecture

Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine (4096 FP16 MACs + 8192 INT8 MACs), Vector unit (2048bit INT8/FP16/FP32) and scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks (CANN).[33]

Ascend 310

The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16.[54] The Ascend 310 features:

Ascend 910

The Ascend 910 is an AI training SoC, it was codenamed Ascend-Max. which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8. The Ascend 910 features:

The Ascend 910 Cluster has 1024–2048 Ascend 910 chips to reach 256–512 petaFLOPS@FP16. The Ascend 910 and Ascend Cluster will be available in Q2 2019.[55]

Similar platforms

The Kirin processors compete with products from several other companies, including:

See also

References

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