The A16 Bionic chip

Mac transition to Apple silicon
Apple silicon ARM architecture family Universal 2 binary Rosetta 2 Developer Transition Kit
v t e

Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of most new Mac computers as well as all iPhone, iPad, Apple TV, and Apple Watch devices and of products such as AirPods, AirTag and HomePod.

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.^[1][2] The first Macs built with the Apple M1 processor were unveiled on November 10, 2020. As of January 2023, all newer Mac models are built with Apple silicon; only the older model Mac Pro still uses Xeon processors.^[3]

Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design.^[4] Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as Samsung and TSMC.

A series

The "A" series is a family of SoCs used in the iPhone, certain iPad models, and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.^[5]

Apple A4

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.^[6] It combines an ARM Cortex-A8 CPU – also used in Samsung's S5PC110A01 SoC^[7][8] – and a PowerVR SGX 535 graphics processor (GPU),^[9][10][11] all built on Samsung's 45-nanometer silicon chip fabrication process.^[12][13] The design emphasizes power efficiency.^[14] The A4 commercially debuted in 2010, in Apple's iPad tablet,^[9] and was later used in the iPhone 4 smartphone,^[15] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.^[16]

The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple^[17][18] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.^[19] The A4 runs at different speeds in different products: 1 GHz in the first iPads,^[20] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.^[21] Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,^[22] and the 2nd-generation Apple TV^[23] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.^[24][25][26] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.^[27]

Apple A5

The Apple A5 is an SoC manufactured by Samsung^[28] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,^[29] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",^[30] according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU^[31] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,^[32] though it can adjust its frequency to save battery life.^[31][33] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.^[34]

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).^[35] The chip in the Apple TV has one core locked.^[36][37] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.^[38]

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.^[39] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.^[40][41]

Apple A5X

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.^[42] It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm²,^[43] for example twice the size of Nvidia Tegra 3.^[44] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.^[45] The RAM in A5X is separate from the main CPU package.^[46]

Apple A6

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.^[47] It is 22% smaller and draws less power than the 45 nm A5.^[48]

The A6 is said to use a 1.3 GHz^[49] custom^[50] Apple-designed ARMv7 based dual-core CPU, called Swift,^[51] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3^[52] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.^[50] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.^[53]

Apple A6X

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.^[54]

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.^[55] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.^[55][56] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.^[56]

Apple A7

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.^[57] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.^[58]

The A7 features an Apple-designed 1.3^[59]–1.4^[60] GHz 64-bit^[61] ARMv8-A^[62][63] dual-core CPU,^[59] called Cyclone,^[62] and an integrated PowerVR G6430 GPU in a four cluster configuration.^[64] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.^[65] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.^[61] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process^[66] and the chip includes over 1 billion transistors on a die 102 mm² in size.^[59]

Apple A8

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.^[67] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.^[68] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.^[69]

The A8 features an Apple-designed 1.4^[70] GHz 64-bit^[71] ARMv8-A^[71] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.^[70] The GPU features custom shader cores and compiler.^[72] The A8 is manufactured on a 20 nm process^[73] by TSMC,^[74] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm² (consistent with a shrink only, not known to be a new microarchitecture).^[75]

Apple A8X

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.^[76] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.^[76][77]

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.^[78] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.^[78] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

Apple A9

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.^[79] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.^[79] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

Apple A9X

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.^[80] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.^[81]

Apple A10 Fusion

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.^[82] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.^[83] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

Apple A10X Fusion

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.^[84] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.^[84] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.^[85]

Apple A11 Bionic

The Apple A11 Bionic is a 64-bit ARM-based SoC^[86] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.^[86] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.^[86][87] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.^[88]

Apple A12 Bionic

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.^[89] The A12 is manufactured by TSMC^[90] using a 7 nm^[91] FinFET process, the first to ship in a smartphone.^[92][90] It is also used in the 6th generation Apple TV.

Apple A12X Bionic

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.^[93] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

Apple A12Z Bionic

The Apple A12Z Bionic is an updated version of the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.^[94] It adds an additional GPU core, compared to the A12X, for improved graphics performance.^[95] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.^[96]

Apple A13 Bionic

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)

The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.^[97]

Apple A14 Bionic

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.^[98] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities. It was later used in the tenth-generation iPad, released on October 26, 2022.

Apple A15 Bionic

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13 and 13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.^[99][100] It is also used in the iPhone SE (3rd generation), iPhone 14, iPhone 14 Plus and iPad Mini 6.^[101]

Apple A16 Bionic

The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 has 16 billion transistors and is built on TSMC's N4 fabrication process, being touted by Apple as the first 4 nm processor in a smartphone.^[102][103] However, N4 is an enhanced version of N5 technology, a de facto third-generation 5 nm manufacturing process.^{[104][105][106]} The chip has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second.

List of processors

General			Image	Semiconductor technology				Computer architecture		CPU											GPU						AI accelerator		Memory technology					First released date	Supported OS
Name	Codename	Part No.		Node	Manufacturer	Transistors count	Die size	CPU ISA	Bit width	Performance core			Efficiency core			Overall cores	Cache				Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity		Initial	Terminal
										Core name	Cores	Core speed	Core name	Cores	Core speed		L1	L2	L3	SLC
[a]	APL0098	S5L8900		90 nm [107]	Samsung		72 mm2 [12]	ARMv6	32-bit	ARM11	1	412 MHz	—	—	—		Single-core	L1i: 16 KB L1d: 16 KB	—	—	—	PowerVR MBX Lite	1	1	8	60 MHz – 103 MHz	0.96 GFLOPS – 1.64 GFLOPS	—	—	16-bit	1 channel 16-bit/channel	LPDDR-266 (133 MHz)	533 MB/s	128 MB	June 29, 2007	iPhone OS 1.0	iPhone OS 3.1.3[b] iOS 4.2.1[c]
[d]	APL0278	S5L8720		65 nm [12]			36 mm2 [12]					533 MHz				103 MHz – 133 MHz										1.64 GFLOPs – 2.12 GFLOPS	32-bit			1 channel 32-bit/channel	1066 MB/s		September 9, 2008		iPhone OS 2.1.1
[e]	APL0298	S5L8920					71.8 mm2 [13]	ARMv7		Cortex-A8		600 MHz				L1i: 32 KB L1d: 32 KB		256 KB	PowerVR SGX535[108]			2		16	200 MHz	6.4 GFLOPS					LPDDR-400 (200 MHz)	1.6 GB/s	256 MB	June 19, 2009	iPhone OS 3.0	iOS 6.1.6
	APL2298	S5L8922		45 nm [12][13][34]			41.6 mm2 [12]																											September 9, 2009	iPhone OS 3.1.1	iOS 5.1.1
A4	APL0398	S5L8930					53.3 mm2 [12][13]					800 MHz						512 KB							200 MHz – 250 MHz	6.4 GFLOPS – 8.0 GFLOPS	64-bit			2 channels 32-bit/channel		3.2 GB/s		April 3, 2010	iPhone OS 3.2 Apple TV Software 4.0	iOS 6.1.6
												1.0 GHz																								iOS 5.1.1[f] Apple TV Software 6.2.1
												800 MHz																					512 MB			iOS 7.1.2
A5	APL0498	S5L8940					122.2 mm2 [34]			Cortex-A9	2	800 MHz					Dual-core	1 MB	PowerVR SGX543[109][52]			2	4	32	200 MHz	12.8 GFLOPS					LPDDR2-800 (400 MHz)	6.4 GB/s		March 11, 2011	iOS 4.3	iOS 9.3.5[g] iOS 9.3.6[h] Apple TV Software 7.6.2
												1.0 GHz
	APL2498	S5L8942		32 nm Hκ MG [35][41]			69.6 mm2 [35]					800 MHz																						March 7, 2012	iOS 5.1
												1.0 GHz
											2 (One core locked)						Dual-core Single-core in actual																		Apple TV Software 5.0
	APL7498	S5L8947					37.8 mm2 [41]				1						Single-core																	January 28, 2013	Apple TV Software 5.2
A5X	APL5498	S5L8945		45 nm [12][13][34]			165 mm2 [43]				2						Dual-core					4	8	64		25.6 GFLOPS	128-bit			4 channels 32-bit/channel		12.8 GB/s	1 GB	March 16, 2012	iOS 5.1
A6	APL0598	S5L8950		32 nm Hκ MG [53][110][56]			96.71 mm2 [53][110]	ARMv7s[111]		Swift[50]		1.3 GHz[112]										3	6	48	266 MHz	68.0 GFLOPS	64-bit			2 channels 32-bit/channel	LPDDR2-1066 (533 MHz)	8.5 GB/s		September 21, 2012	iOS 6.0	iOS 10.3.3[i] iOS 10.3.4[j]
A6X	APL5598	S5L8955					123 mm2 [56]					1.4 GHz[55]							PowerVR SGX554[55][113]			4	16	128	300 MHz	76.8 GFLOPS	128-bit			4 channels 32-bit/channel		17.0 GB/s		November 2, 2012
A7	APL0698	S5L8960		28 nm Hκ MG [66][114]		1 billion	102 mm2 [61][114]	ARMv8.0-A [62][70]	64-bit	Cyclone		1.3 GHz				L1i: 64 KB L1d: 64 KB			4 MB (Inclusive) [62][115][60]	PowerVR G6430[64][113]					450 MHz	115.2 GFLOPS	64-bit			1 channel 64-bit/channel	LPDDR3-1600 (800 MHz)	12.8 GB/s		September 20, 2013	iOS 7.0	iOS 12.5.7
	APL5698	S5L8965										1.4 GHz																						November 1, 2013	iOS 7.0.3
A8	APL1011	T7000		20 nm Hκ MG [71][70]	TSMC	2 billion	89 mm2 [116][78] [117]			Typhoon		1.1 GHz								PowerVR GX6450[72][118][119]					533 MHz	136.4 GFLOPS								September 19, 2014	iOS 8.0
												1.4 GHz
																																			audioOS 11.0	HomePod Software 15.6 (Current)
												1.5 GHz																					2 GB		iOS 8.0 tvOS 9.0	iPadOS 15.7.6 (Current) tvOS 16.5 (Current)
A8X	APL1021	T7001				3 billion	128 mm2 [78]				3	1.5 GHz					3-core	2 MB		PowerVR GX6850[72][78][117]		8	32	256	450 MHz	230.4 GFLOPS	128-bit			2 channels 64-bit/channel		25.6 GB/s		October 22, 2014	iOS 8.1	iPadOS 15.7.6 (Current)
A9	APL0898	S8000		14 nm FinFET [120]	Samsung	≥ 2 billion	96 mm2 [121]			Twister	2	1.85 GHz[122][123]					Dual-core	3 MB	4 MB (Victim) [115][124]	PowerVR GT7600[72][125]		6	24	192	650 MHz	249.6 GFLOPS	64-bit			1 channel 64-bit/channel	LPDDR4-3200 (1600 MHz)			September 25, 2015	iOS 9.0	iOS 15.7.6 (Current) iPadOS 16.5 (Current) tvOS 16.5 (Current)
	APL1022	S8003		16 nm FinFET [121][126][127]	TSMC		104.5 mm2 [121]
A9X	APL1021	S8001				≥ 3 billion	143.9 mm2 [126][85]					2.16 GHz[128][129]							—[115][126]	PowerVR GT7850[72][126]		12	48	384	650 MHz	499.2 GFLOPS	128-bit (64-bit in actual)			2 channels (one channel is unused) 64-bit/channel				November 11, 2015	iOS 9.1
												2.26 GHz															128-bit			2 channels 64-bit/channel		51.2 GB/s	4 GB
A10 Fusion	APL1W24	T8010				3.3 billion	125 mm2 [127]	ARMv8.1-A		Hurricane	2	1.64 GHz	Zephyr	2	1.09 GHz	Quad-core (Only 2 cores performed at a same time)	P-core: L1i: 64 KB L1d: 64 KB E-core: L1i: 32 KB L1d: 32KB	P-core: 3 MB E-core: 1 MB	4 MB	PowerVR GT7600 Plus[130][72][131][132]		6	24	192	900 MHz	345.6 GFLOPS	64-bit			1 channel 64-bit/channel		25.6 GB/s	2 GB	September 16, 2016	iOS 10.0
												2.34 GHz
																																	3 GB
A10X Fusion	APL1071	T8011		10 nm FinFET [85]		≥ 4 billion	96.4 mm2 [85]				3	2.38 GHz		3	1.30 GHz	6-core (Only 3 cores performed at a same time)		P-core: 8 MB E-core: 1 MB	—[133][134]		4 MB	12	48	384	1000 MHz	768.0 GFLOPS	128-bit			2 channels 64-bit/channel		51.2 GB/s	3 GB	June 13, 2017	tvOS 11.0
																																	4 GB		iOS 10.3.2
A11 Bionic	APL1W72	T8015				4.3 billion	87.66 mm2 [135]	ARMv8.2-A[136]		Monsoon	2	2.39 GHz	Mistral	4	1.19 GHz	6-core				First generation Apple-designed		3	12	192	1066 MHz	409.3 GFLOPS	2	600 billion OPS	64-bit	1 channel 64-bit/channel	LPDDR4X-4266 (2133 MHz)	34.1 GB/s	2 GB	September 22, 2017	iOS 11.0	iOS 16.5 (Current) iPadOS 16.5 (Current) tvOS 16.5 (Current)
																																	3 GB
A12 Bionic	APL1W81	T8020		7 nm (N7) FinFET		6.9 billion	83.27 mm2 [137]	ARMv8.3-A[138]		Vortex		2.49 GHz	Tempest		1.59 GHz		P-core: L1i: 128 KB L1d: 128 KB E-core: L1i: 32 KB L1d: 32KB	P-core: 8 MB E-core: 2 MB		8 MB	Second generation Apple-designed (Apple G11P)	4	16	256	1125 MHz	576.0 GFLOPS	8	5 TOPS						September 21, 2018	iOS 12.0 tvOS 14.5
																																	4 GB
A12X Bionic	APL1083	T8027				10 billion	135 mm2 [139]				4					8-core					Second generation Apple-designed (Apple G11G)	7	28	448	1125 MHz	1.008 TFLOPS			128-bit	2 channels 64-bit/channel		68.2 GB/s		November 7, 2018	iOS 12.1
																																	6 GB
A12Z Bionic																						8	32	512		1.152 TFLOPS								March 25, 2020	iPadOS 13.4
																																	16 GB	June 22, 2020	macOS Big Sur 11.0 Beta 1	macOS Big Sur 11.3 Beta 2
A13 Bionic	APL1W85	T8030		7 nm (N7P) FinFET		8.5 billion	98.48 mm2 [140]	ARMv8.4-A[141]		Lightning	2	2.65 GHz	Thunder		1.72 GHz	6-core	P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 96 KB L1d: 48 KB	P-core: 8 MB E-core: 4 MB		16 MB	Third generation Apple-designed[142]	4	16	256	1230 MHz	630 GFLOPS		5.5 TOPS	64-bit	1 channel 64-bit/channel		34.1 GB/s	3 GB	September 20, 2019	iOS 13.0 iPadOS 13.0	iOS 16.5 (Current) iPadOS 16.5 (Current)
																																	4 GB
A14 Bionic	APL1W01	T8101		5 nm (N5) FinFET		11.8 billion	88 mm2 [143]	ARMv8.5-A[144]		Firestorm		3.00 GHz	Icestorm		1.82 GHz		P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB				Fourth generation Apple-designed[145][142][146][147]		16	256	1278 MHz	654 GFLOPS	16	11 TOPS						October 23, 2020	iOS 14.0 iPadOS 14.0
																																	6 GB
A15 Bionic	APL1W07 [148]	T8110		5 nm (N5P) FinFET		15 billion	107.68 mm2[148]			Avalanche		3.24 GHz	Blizzard		2.02 GHz			P-core: 12 MB E-core: 4 MB		32 MB	Fifth generation Apple-designed[149][150][151]		16[152]	512[152]	1338 MHz[152][153]	1.370 TFLOPS		15.8 TOPS					4 GB	September 24, 2021	iOS 15.0 iPadOS 15.0
												2.93 GHz										5	20[153]	640[153]		1.713 TFLOPS
												3.24 GHz																					6 GB
A16 Bionic	APL1W10 [154]	T8120		5 nm (N4P) FinFET [104][105][106][103][155]		16 billion		ARMv8.6-A [156]		Everest [157][158]		3.46 GHz	Sawtooth [157][158]					P-core: 16 MB E-core: 4 MB [159]		24 MB [159]	Sixth generation Apple-designed		20[160]	640[160]	1398 MHz[160]	1.789 TFLOPS[160]		17 TOPS			LPDDR5-6400 (3200 MHz)	51.2 GB/s		September 7, 2022	iOS 16.0
Name	Codename	Part No.	Image	Node		Manufacturer	Transistors count	Die size		CPU ISA	Bit width	Core name	Cores		Core speed	Core name	Cores	Core speed		Overall cores	L1	L2	L3	SLC	Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type		Theoretical bandwidth	Available capacity	First released date	Initial	Terminal
												Performance core			Efficiency core			Cache
General				Semiconductor technology				Computer architecture		CPU											GPU						AI accelerator		Memory technology					Supported OS

H series

The Apple "H" series is a family of SoCs with low-power audio processing and wireless connectivity for use in headphones.

Apple H1

The Apple H1 chip was first used in the 2019 version of AirPods, and was later used in the Powerbeats Pro, the Beats Solo Pro, Beat Fit Pro, the AirPods Pro, the 2020 Powerbeats, AirPods Max,^[161] and the AirPods (3rd generation). Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,^[162] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.^[163]

Apple H2

The Apple H2 chip was first used in the 2022 version of AirPods Pro. It has Bluetooth 5.3, and implements 48 kHz noise reduction in hardware.

List of processors

Name	Model no.	Image	Bluetooth	First Released
H1	343S00289[164] (AirPods 2nd Generation) 343S00290[165] (AirPods 2nd Generation) 343S00404[166] (AirPods Max) H1 SiP[167] (AirPods Pro)		5.0	March 20, 2019
H2	AirPods Pro (2nd generation)		5.3	September 7, 2022

M series

The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, and iPad Air tablets from March 2022 or later. The "M" designation was previously used for Apple motion coprocessors.

Apple M1

The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it is used in the MacBook Air (M1, 2020), Mac mini (M1, 2020), MacBook Pro (13-inch, M1, 2020), iMac (24-inch, M1, 2021), iPad Pro (5th generation) and iPad Air (5th generation). It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.^[168]

Apple M1 Pro

The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple said the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

Apple M1 Max

The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple says it has 57 billion transistors.^[169] Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

Apple M1 Ultra

The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion technology.^[170] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.^[171]

Apple M2

Apple announced the M2 SoC on June 6, 2022, at WWDC, along with the new MacBook Air and the new 13-inch MacBook Pro and later the iPad Pro (6th generation). It is the successor to the Apple M1. The M2 is made with TSMC's "Enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.^[172]

Apple M2 Pro

The M2 Pro is a more powerful version of the M2, with six to eight performance cores, four efficiency cores, 16 to 19 core GPU, 16 Apple Next Generation Neural Engine cores, up to 32 GBs of unified RAM with up to 200 GB/s memory bandwidth, and over 40 billion transistors, 20 percent more than the M1 Pro and twice the M2. It was announced on January 17, 2023 in a press release and it is used in the 14 and 16 inch 2023 MacBook Pro (Apple silicon) as well as the Mac Mini. Apple claims the CPU performance on the M2 Pro is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the one on the M1 Pro.^[173]

Apple M2 Max

The M2 Max is a larger more powerful version of the M2 Pro, with eight performance cores, four efficiency cores, 30 to 38 core GPU, 16 Apple Next Generation Neural Engine cores, up to 96GBs of unified RAM with up to 400 GB/s memory bandwidth, and over 67 billion transistors, 10 billion more than the M1 Max and 3x the M2. It was announced on January 17, 2023 in a press release and it is used in the 14 and 16 inch 2023 MacBook Pro (Apple silicon). Apple claims the CPU performance on the M2 Max is 20 percent faster that M1 Max and the GPU is 30 percent faster than the M1 Max. According to Apple, "the M2 Max is the most powerful and efficient chip in a pro laptop".^[173]

List of processors

General			Semiconductor technology		CPU											GPU						AI accelerator		Memory technology					Connectivity				First released date	Supported OS
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	Codename		Cores		Clocks (GHz)		Cache				Vendor	Cores	SIMD EU count	FP32 ALU count	Frequency	FP32 FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Ports			External display		Initial	Terminal
						P	E	P	E	P	E	L1	L2	L3	SLC														Thunderbolt	USB	Max
M1	APL1102 T8103		TSMC N5	16 billion 118.91 mm² [174]	ARMv8.5-A	Firestorm	Icestorm	4	4	3.204	2.064	P-core: L1i: 192 KB L1d: 128 KB E-core: L1i: 128 KB L1d: 64 KB	P-core: 12 MB E-core: 4 MB	—	8 MB	Fourth generation Apple-designed	7	28	896	1278 MHz	2.290 TFLOPS	16	11 TOPS	128-bit	2 channels 64-bit/channel	LPDDR4X-4266 (2133 MHz)	66.67 GB/s	8 GB 16 GB[k]	Thunderbolt 3 (Up to 40 Gbit/s)[l]	USB4 (Up to 40 Gbit/s)[m] USB 3.1 Gen 2 (Up to 10 Gbit/s)	iPad: 1 Thunderbolt/USB4[n] MacBook and Mac Desktop: 2 Thunderbolt/USB4 iMac (4 ports): Additional 2 USB-C Mac mini: Additional 2 USB-A and 1 HDMI 2.0	All: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt/USB-C Mac mini: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	November 10, 2020	macOS Big Sur 11.0 iPadOS 14.5	macOS Ventura 13.4 (Current) iPadOS 16.5 (Current)
																	8	32	1024		2.617 TFLOPS
M1 Pro	APL1103 T6000			33.7 billion ≈ 245 mm² [175]				6	2	3.228			P-core: 24 MB E-core: 4 MB		24 MB		14	56	1792	1296 MHz	4.644 TFLOPS			256-bit	2 channels 128-bit/channel	LPDDR5-6400 (3200 MHz)	204.8 GB/s	16 GB 32 GB[o]	Thunderbolt 4 (Up to 40 Gbit/s)		MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0	Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt or One 6016 x 3384 at 60 Hz at 10-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI	October 26, 2021	macOS Monterey 12.0	macOS Ventura 13.4 (Current)
								8
																	16	64	2048		5.308 TFLOPS
M1 Max	APL1105 T6001 [176]			57 billion ≈ 432 mm² [175]											48 MB		24	96	3072		7.962 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB[p]			MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0 Mac Studio: 4 Thunderbolt 4, 2 USB-C, 1 SDXC slot and 1 HDMI 2.0	MacBook: Three 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI Mac Studio: Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI
																	32	128	4096		10.616 TFLOPS
M1 Ultra	APL1W06 T6002			114 billion ≈ 864 mm²				16	4				P-core: 48 MB E-core: 8 MB		96 MB		48	192	6144		15.925 TFLOPS	32	22 TOPS	1024-bit	8 channels 128-bit/channel		819.2 GB/s	64 GB 128 GB[q]			6 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.0	Four 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 10-bit color depth display over HDMI	March 18, 2022	macOS Monterey 12.3
																	64	256	8192		21.233 TFLOPS
M2	APL1109 T8112		TSMC N5P	20 billion 155.25 mm² [174]		Avalanche	Blizzard	4	4	3.504	2.424		P-core: 16 MB E-core: 4 MB		8 MB	Fifth generation Apple-designed	8	32	1024	1398 MHz	2.863 TFLOPS	16	15.8 TOPS	128-bit	2 channels 64-bit/channel		102.4 GB/s	8 GB 16 GB[r] 24 GB[s]	Thunderbolt 3 (Up to 40 Gbit/s)[t] Thunderbolt 4 (Up to 40 Gbit/s)[u]		iPad: 1 Thunderbolt/USB4 MacBook: 2 Thunderbolt/USB4 Mac mini: 2 Thunderbolt 4, 2 USB-A and 1 HDMI 2.0	All: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt Mac mini: One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 5120 x 2880 at 60 Hz at 8-bit color depth display over Thunderbolt or One 6016 x 3384 at 60 Hz at 8-bit color depth display over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	July 15, 2022	macOS Monterey 12.4 iPadOS 16.1	macOS Ventura 13.4 (Current) iPadOS 16.5 (Current)
																	10	40	1280		3.578 TFLOPS												June 24, 2022
M2 Pro	T6020			40 billion				6					P-core: 32 MB E-core: 4 MB		TBC		16	64	2048		5.726 TFLOPS			256-bit	4 channels 64-bit/channel		204.8 GB/s	16 GB 32 GB[v]	Thunderbolt 4 (Up to 40 Gbit/s)		MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.1 Mac mini: 4 Thunderbolt 4, 2 USB-A and 1 HDMI 2.1	All: One 6016 x 3384 at 60 Hz at 10-bit color depth display over Thunderbolt and one 3840 x 2160 at 144 Hz at 8-bit color depth display over HDMI or One 3840 x 2160 at 240 Hz at 8-bit color depth display over HDMI or One 7680 x 4320 at 60 Hz at 8-bit color depth display over HDMI or MacBook: Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt Mac mini: Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 60 Hz at 8-bit color depth display over HDMI	January 17, 2023	macOS Ventura 13.2	macOS Ventura 13.4 (Current)
								8									19	76	2432		6.799 TFLOPS
M2 Max	T6021			67 billion						3.667					TBC		30	120	3840		10.736 TFLOPS			512-bit	4 channels 128-bit/channel		409.6 GB/s	32 GB 64 GB[w] 96 GB[x]			MacBook: 3 Thunderbolt 4, 1 SDXC slot and 1 HDMI 2.1	MacBook: Three 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 144 Hz at 8-bit color depth display over HDMI or Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 3840 x 2160 at 240 Hz at 8-bit color depth display over HDMI or Two 6016 x 3384 at 60 Hz at 10-bit color depth displays over Thunderbolt and one 7680 x 4320 at 60 Hz at 8-bit color depth display over HDMI
																	38	152	4864		13.599 TFLOPS
Name	Codename and part no.	Image	Process	Transistor count and die size	CPU ISA	P	E	P	E	P	E	L1	L2	L3	SLC	Vendor	Cores	EU count	ALU count	Frequency	FLOPS	Cores	OPS	Memory bus width	Total channel Bit per channel	Memory type	Theoretical bandwidth	Available capacity	Thunderbolt	USB	Max	External display	First released date	Initial	Terminal
						Codename		Cores		Clocks (GHz)		Cache																	Ports
General			Semiconductor technology		CPU											GPU						AI accelerator		Memory technology					Connectivity					Supported OS

S series

The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch and HomePod. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

Apple S1

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.^[177]

Apple S1P

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.^[178][179]

Apple S2

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,^[180] and is similar in performance to the Apple S1P.^[181]

Apple S3

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.^[182] There is also an option for a cellular modem and an internal eSIM module.^[182] It also includes the W2 chip.^[182] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.^[182]

Apple S4

Used in the Apple Watch Series 4. It has a custom 64-bit dual-core processor based on the A12 with up to 2× faster performance. It also contains the W3 wireless chip, which supports Bluetooth 5. The S4 introduced 64-bit ARMv8 cores to the Apple Watch. The chip contains two Tempest cores,^[183][184] which are the energy-efficient cores found in the A12. Despite the small size, Tempest still uses a 3-wide decode out-of-order superscalar design, which make them much more powerful than previous in-order cores.

The S4 contains a Neural Engine that is able to run Core ML.^[185] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.^[186] It also contains a new custom GPU, which can use the Metal API.^[187]

Apple S5

Used in the Apple Watch Series 5, Watch SE, and HomePod mini.^[188] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.^[189]

Apple S6

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.^[190][191] The dual cores in the S6 are based on the A13's energy-efficient "little" Thunder cores at 1.8 GHz.^[192] Like the S4 and S5, it also contains the W3 wireless chip.^[191] The S6 adds the new U1 ultra wideband chip, an always-on altimeter, and 5 GHz WiFi.^[190][191]

Apple S7

Used in the Apple Watch Series 7 and second-generation HomePod. The S7 has the same T8301 identifier and quoted performance as the S6.^[193]

Apple S8

Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra. The S8 adds a new three-axis gyroscope and high g-force accelerometer.^[194] It has the same T8301 identifier and quoted performance as the S6 and S7.^[195]

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	Modem	First Released	Utilizing devices	Initial OS	Terminal OS
S1	APL 0778 [196]		28 nm Hκ MG[197][198]	32 mm2[197]	ARMv7k[198][199]	520 MHz single-core Cortex-A7[198]	L1d: 32 KB[198] L2: 256 KB[198]	PowerVR Series 5[198][200]	LPDDR3[201]		April 2015	Apple Watch (1st generation)	watchOS 1.0	watchOS 4.3.2
S1P	TBC		TBC		ARMv7k[202][203][180]	520 MHz dual-core Cortex-A7 without GPS[202]	TBC	PowerVR Series 6 'Rogue'[202]	LPDDR3		September 2016	Apple Watch Series 1	watchOS 3.0	watchOS 6.3
S2						520 MHz dual-core Cortex-A7[202]						Apple Watch Series 2
S3					ARMv7k[204]	Dual-core	TBC		LPDDR4	Qualcomm MDM9635M (Snapdragon X7 LTE)	September 2017	Apple Watch Series 3	watchOS 4.0	watchOS 8.7.1
S4			7 nm (TSMC N7)	TBC	ARMv8-A ILP32[205][206]	1.59 GHz Dual-core Tempest	TBC	Apple G11M[206]	TBC		September 2018	Apple Watch Series 4	watchOS 5.0	watchOS 9.0 (Current) audioOS 16.0 (Current)
S5											September 2019	Apple Watch SE Apple Watch Series 5 HomePod Mini	watchOS 6.0 audioOS 14.2
S6			7 nm (TSMC N7P)	TBC		1.8 GHz Dual-core Thunder	TBC				September 2020	Apple Watch Series 6	watchOS 7.0
S7											October 2021	Apple Watch Series 7 HomePod (2nd generation)	watchOS 8.0 audioOS 16.3
S8											September 2022	Apple Watch SE (2nd generation) Apple Watch Series 8 Apple Watch Ultra	watchOS 9.0
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	Modem	First Released	Utilizing devices	Initial OS	Terminal OS

T series

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.^[207] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.

Apple T1

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.^[208]

Apple T2

The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010), and runs bridgeOS.^[209] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.^{[210][211][212]} T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.^[213][214]

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory technology	First Released
									Memory bandwidth
T1	APL 1023 [215]		Same as S2	TBC	ARMv7			TBD		November 12, 2016
T2	APL 1027 [216]		TSMC 16 nm FinFET.[217]	104 mm2[217]	ARMv8-A ARMv7-A	2× Hurricane 2× Zephyr + Cortex-A7	L1i: 64 KB L1d: 64 KB L2: 3 MB[217]	3× cores[217]	LP-DDR4[217]	December 14, 2017
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	GPU	Memory bandwidth	First Released
									Memory technology

U series

The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband (UWB) radio.

Apple U1

The Apple U1 is used in the iPhone 11 series and later (excluding the second and third generation iPhone SE), Apple Watch Series 6 and newer, HomePod (2nd generation), HomePod Mini, AirTag trackers and the charging case for AirPods Pro (2nd generation).^[218]

List of processors

Name	Model no.	Image	CPU	Semiconductor technology	First Released
U1	TMK A75 [219]		Cortex-M4 ARMv7E-M[220]	16 nm FinFET (TSMC 16FF)	September 20, 2019
Name	Model no.	Image	CPU	Semiconductor technology	First Released

W series

The Apple "W" series is a family of RF SoCs used for Bluetooth and Wi-Fi connectivity.

Apple W1

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.^[221][222] It maintains a Bluetooth^[223] Class 1 connection with a computer device and decodes the audio stream that is sent to it.^[224]

Apple W2

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple said the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.^[182]

Apple W3

The Apple W3 is used in the Apple Watch Series 4,^[225] Series 5,^[226] Series 6,^[191] SE (1st generation),^[191] Series 7, Series 8, SE (2nd generation), and Ultra. It is integrated into the Apple S4, S5, S6, S7 and S8 SiPs. It supports Bluetooth 5.0/5.3.

List of processors

Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory technology	Bluetooth	First Released
								Memory bandwidth
W1	343S00130[227] 343S00131[227]		TBC	14.3  mm2 [227]	TBC				4.2	December 13, 2016
W2	338S00348[228]		TBC							September 22, 2017
W3	338S00464[229]								5.0/5.3	September 21, 2018
Name	Model no.	Image	Semiconductor technology	Die size	CPU ISA	CPU	CPU cache	Memory bandwidth	Bluetooth	First Released
								Memory technology

M-series coprocessors

The Apple M-series coprocessors are motion coprocessors used by Apple Inc. in their mobile devices. First released in 2013, their function is to collect sensor data from integrated accelerometers, gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit (CPU).

Only the M7 and M8 coprocessors were housed on separate chips; the M9, M10, and M11 coprocessors were embedded in their corresponding A-series chips. Beginning with the A12 Bionic chip in 2018, the motion coprocessors were fully integrated into the SoC; this allowed Apple to reuse the "M"-series codename for their desktop SoCs.

List of coprocessors

Name	Model no.	Image	Semiconductor technology	CPU ISA	CPU	First Released	Utilizing devices
Apple M7	LPC18A1		90 nm	ARMv7-M	150 MHz Cortex-M3	September 10, 2013	iPhone 5s iPad Air iPad Mini 2 iPad Mini 3
Apple M8	LPC18B1					September 9, 2014	iPhone 6 iPhone 6 Plus iPad Mini 4 iPod Touch (6th generation)
Name	Model no.	Image	Semiconductor technology	CPU ISA	CPU	First Released	Utilizing devices

Miscellaneous devices

This segment is about Apple-designed processors that are not easily sorted into another section.

Early series

Apple first used SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B^[230] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.^[12] The iPhone 3G and the first-generation iPod Touch also use it.^[231]

The APL0278^[232] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.^[12][231]

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.^[107]

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC^[12] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.

Other

The Samsung S5L8747 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iPhone, iPod Touch, or iPad, then taking a serial signal from the iOS device translating that into a proper HDMI signal.^[233][234]

Model no.	Image	First released	CPU ISA	Specs	Application	Utilizing devices	Operating system
339S0196		September 2012	Unknown ARM	256 MB RAM	Lightning to HDMI conversion	Apple Digital AV Adapter	XNU
Model no.	Image	First released	CPU ISA	Specs	Application	Utilizing devices	Operating system